TT Electronics/IRC

GS4B022672FT

GS4B022672FT Description

The GS4B022672FT from TT Electronics/IRC is a high-performance 7-resistor bussed network in an 8-pin narrow SOIC package, designed for precision applications requiring stable thin-film resistance. Encased in a ceramic substrate, it delivers superior thermal stability with a ±50ppm/°C temperature coefficient and ±1% tolerance on its 26.7KΩ resistance value. Rated for 100V maximum voltage and 0.4W total power dissipation, it operates reliably across 70°C to 125°C (derated) with a 125°C maximum operating temperature. The SOIC-C series features gull-wing terminations for robust surface-mount assembly, with tight dimensional tolerances (±0.1mm height/length, ±0.2mm depth) ensuring compatibility with automated PCB processes.

GS4B022672FT Features

• Bussed Network Topology: Simplifies circuit design with shared common connections (BUS), reducing component count.
• Thin-Film Technology: Offers low noise, high accuracy (±1%), and stable performance under thermal stress.
• Ceramic Case: Enhances durability and heat dissipation vs. polymer-based networks.
• High Voltage Rating: Supports up to 100V, ideal for industrial and instrumentation systems.
• Precision Tolerance: Tight ±50ppm/°C TCR ensures minimal drift in temperature-sensitive applications.
• Compact SOIC Package: 4.9mm × 5.99mm footprint and 1.45mm profile save board space.

GS4B022672FT Applications

This resistor network excels in:

• Analog Signal Conditioning: Voltage dividers, sensor interfaces in medical/industrial equipment.
• Power Management Circuits: Feedback networks in DC-DC converters or LED drivers.
• Automotive Electronics: Non-automotive grade but suitable for benign-environment control modules.
• Test & Measurement: Precision calibration circuits due to low TCR and high stability.
• Aerospace & Defense: Rugged ceramic construction meets demands for reliability in harsh conditions.

Conclusion of GS4B022672FT

The GS4B022672FT combines ceramic robustness, thin-film precision, and space-efficient packaging to address challenges in high-reliability electronics. Its bussed design reduces layout complexity, while ±1% tolerance and low TCR make it a standout for precision analog circuits. Though not PPAP or RoHS compliant, its performance suits industrial, instrumentation, and aerospace applications where stability and compactness are critical. For engineers seeking a balance of accuracy, power handling, and thermal resilience, this network is a compelling choice.