


TT Electronics/IRC
GS4B022700JT
Why Choose Us?
Professional Platform
B2B & B2C purchasingDelivery at full speed
1-2 days deliveryWide variety
Original manufacturers365 days guarantee
Responsible qualityTech Specifications
GS4B022700JT Description
GS4B022700JT Description
The GS4B022700JT from TT Electronics/IRC is a high-reliability 7-resistor bussed network in an 8-pin narrow SOIC (SOIC-C) package, designed for precision surface-mount applications. This ceramic-based thin-film resistor network offers a 270Ω resistance per element with a ±5% tolerance and a low ±50ppm/°C temperature coefficient, ensuring stable performance across a wide operating temperature range of -55°C to +125°C. With a 0.05W (1/20W) power rating per resistor and a total power rating of 0.4W, it balances compactness with robust performance. The 100V maximum voltage rating and gull-wing termination make it suitable for automated PCB assembly. Its non-compliant EU RoHS status and unconfirmed part status may limit use in certain regulated applications.
GS4B022700JT Features
- Ceramic substrate for enhanced thermal stability and durability.
- 7 bussed resistors in an 8-pin SOIC package, optimizing space in dense layouts.
- Thin-film technology ensures precision (±5%) and low TCR (±50ppm/°C).
- 0.4W total power dissipation (0.05W per resistor) for reliable operation in power-sensitive designs.
- Gull-wing leads (1.27mm pitch) facilitate high-speed SMT assembly.
- Wide temperature range (-55°C to +125°C) with derated power up to 125°C.
- Non-automotive and non-PPAP certified, ideal for industrial/commercial use.
GS4B022700JT Applications
This resistor network excels in:
- Voltage division/current limiting in power supplies and signal conditioning circuits.
- Bus termination for digital communication interfaces (e.g., SPI, I²C).
- Sensor networks requiring stable resistance under thermal stress.
- Medical/industrial equipment where ceramic substrates mitigate thermal drift.
- Space-constrained PCBs (4.9mm × 5.99mm footprint, 1.45mm height).
Conclusion of GS4B022700JT
The GS4B022700JT combines ceramic ruggedness, thin-film precision, and compact SOIC packaging, making it a versatile choice for industrial, telecom, and instrumentation designs. While not suited for automotive or RoHS-compliant projects, its bussed architecture and stable TCR provide a cost-effective solution for noise-sensitive or thermally challenging environments. Engineers should verify part status for critical applications.



.png)














.png?x-oss-process=image/format,webp/resize,h_32)










