TT Electronics/IRC

GS4B022801FT

GS4B022801FT Description

The GS4B022801FT from TT Electronics/IRC is a high-performance 7-resistor bussed network in an 8-pin narrow SOIC package, designed for precision applications requiring stable thin-film resistance. With a 2.8KΩ resistance per element and a tight ±1% tolerance, this ceramic-based network ensures reliable signal conditioning and voltage division. Its ±50ppm/°C temperature coefficient and 125°C maximum operating temperature make it suitable for environments with thermal fluctuations. The SOIC-C series construction offers robust mechanical stability, while the gull-wing termination facilitates easy surface mounting. Rated for 100V maximum voltage and 0.4W total power dissipation, it balances compactness (4.9mm × 5.99mm × 1.45mm) with durability.

GS4B022801FT Features

• Bussed Network Design: 7 resistors connected in a common bus configuration (Circuit Designator: BUS), simplifying PCB layout.
• High Precision: Thin-film technology delivers ±1% absolute tolerance and low TCR (±50ppm/°C).
• Robust Construction: Ceramic case ensures thermal stability and mechanical strength.
• Wide Operating Range: Derated power up to 125°C, ideal for industrial and automotive-adjacent applications (though not PPAP/automotive-certified).
• Surface-Mount Ready: Gull-wing terminals with 1.27mm pitch for compatibility with standard SOIC footprints.
• Non-RoHS (EU): Suitable for legacy or exempted applications requiring leaded components.

GS4B022801FT Applications

• Signal Conditioning: Precision voltage dividers in sensor interfaces or ADC circuits.
• Industrial Controls: Stable resistance networks in PLCs, motor drivers, and power supplies.
• Test & Measurement Equipment: High-accuracy reference networks for calibration devices.
• Consumer Electronics: Durable resistor arrays in audio amplifiers or display drivers.
• Legacy Systems: Non-RoHS compliance makes it viable for military or aerospace repairs.

Conclusion of GS4B022801FT

The GS4B022801FT excels in precision and reliability, leveraging thin-film technology and ceramic packaging for demanding environments. Its bussed design reduces component count, while the SOIC form factor ensures compatibility with automated assembly. Though not automotive-grade, its wide temperature range and low TCR make it a versatile choice for industrial, instrumentation, and high-reliability consumer applications. Engineers will appreciate its balance of performance, compactness, and cost-effectiveness in space-constrained designs.