TT Electronics/IRC

GS4B023001FAT

GS4B023001FAT Description

The GS4B023001FAT from TT Electronics/IRC is a high-precision 7-resistor thin-film network in an 8-pin SOIC package, designed for surface-mount applications. It features a 3K Ohm resistance per element with a tight 1% tolerance and a low ±50ppm/°C temperature coefficient, ensuring stable performance across a 70°C to 125°C operating range. The ceramic case style and gull-wing termination provide robust mechanical and thermal stability, while the 0.4W total power rating (0.05W per resistor) supports moderate power dissipation. With a 100V maximum voltage rating, this network is ideal for bus termination, voltage division, and signal conditioning in compact PCB designs.

GS4B023001FAT Features

• Precision Thin Film Technology: Delivers low noise and high stability for critical analog/digital circuits.
• Compact SOIC Package: 4.9mm (L) × 5.99mm (D) × 1.45mm (H) with tight tolerances (±0.1mm L/H, ±0.2mm D) for space-constrained layouts.
• High-Temperature Resilience: Rated for 125°C maximum operating temperature, suitable for industrial environments.
• Gull-Wing Termination: Ensures reliable solder joints in automated SMT assembly.
• Non-Automotive (PPAP No): Optimized for general-purpose industrial and consumer electronics.
• Non-RoHS Compliant: Suitable for legacy or exempted applications requiring specific material properties.

GS4B023001FAT Applications

• Bus Termination Networks: Minimizes signal reflection in high-speed digital systems (e.g., memory buses).
• Voltage Dividers: Precision ratio matching in sensor interfaces or ADC reference circuits.
• Signal Conditioning: Stable impedance matching in communication modules (e.g., RS-485, CAN).
• Industrial Control Systems: Durable performance in PLCs, motor drives, and power management PCBs.
• Legacy Electronics Repair: Direct replacement for non-RoHS compliant designs.

Conclusion of GS4B023001FAT

The GS4B023001FAT combines precision, compactness, and thermal resilience, making it a versatile choice for dense, high-reliability circuits. Its ceramic construction and thin-film technology outperform cheaper thick-film alternatives in stability and longevity. While not suited for automotive or RoHS-mandated designs, it excels in industrial, telecom, and legacy systems where accuracy and durability are paramount. The tube packaging ensures safe handling for medium-volume production.