TT Electronics/IRC

GS4B023011DT

GS4B023011DT Description

The GS4B023011DT from TT Electronics/IRC is a high-precision 7-resistor bussed network in an 8-pin narrow SOIC package. Designed for surface-mount applications, it features a 3.01KΩ resistance per element with an ultra-tight ±0.5% absolute tolerance and a low ±50ppm/°C temperature coefficient. The ceramic-based thin-film technology ensures stability across a wide temperature range (70°C to 125°C derated, 125°C max). With a 0.4W total power rating (0.05W per resistor) and 100V maximum voltage rating, this network is engineered for reliability in demanding circuits. Its gull-wing termination and 1.27mm pitch facilitate easy PCB integration, while the compact dimensions (4.9mm x 5.99mm x 1.45mm) suit space-constrained designs.

GS4B023011DT Features

• Bussed Architecture: 7 resistors tied to a common node, simplifying bus line designs.
• High Precision: ±0.5% tolerance and ±50ppm/°C TCR for stable performance in precision analog/digital circuits.
• Robust Construction: Ceramic SOIC case with thin-film resistors ensures durability and thermal stability.
• Optimized Power Handling: 0.4W total dissipation (0.05W per element) at 125°C max.
• Automation-Friendly: Gull-wing leads and 1.27mm pitch align with high-volume SMT assembly.
• Non-Automotive/Non-PPAP: Ideal for industrial, telecom, and instrumentation applications.

GS4B023011DT Applications

• Voltage Divider Networks: Precision attenuation in sensor interfaces or ADCs.
• Bus Termination: Impedance matching for data/address lines in digital systems.
• Signal Conditioning: Stable reference resistors in op-amp circuits or filters.
• Power Management: Current-limiting or pull-up networks in low-power PCBs.
• Test & Measurement Equipment: High-accuracy resistance requirements in lab instruments.

Conclusion of GS4B023011DT

The GS4B023011DT excels in precision, power efficiency, and space-saving design, making it a superior choice for industrial, telecom, and embedded systems. Its ceramic thin-film construction and bussed topology reduce component count while maintaining performance, offering a cost-effective solution for high-density PCBs. Though not PPAP or automotive-grade, its tight tolerances and thermal resilience cater to mission-critical electronics where reliability is paramount.