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GS4B023090FFT
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GS4B023090FFT Description
GS4B023090FFT Description
The GS4B023090FFT from TT Electronics/IRC is a high-performance 7-resistor bussed network in an 8-pin narrow SOIC (SOIC-C) ceramic package. Designed for precision applications, it features a 309Ω resistance value with a tight ±1% absolute tolerance and ±1% ratio tolerance, ensuring consistent performance in matched circuits. The thin-film technology delivers excellent stability with a low ±50ppm/°C temperature coefficient, making it ideal for environments with fluctuating temperatures. Rated for 0.05W (1/20W) per resistor and 0.4W total power dissipation, it operates reliably across a 70°C to 125°C derated power range, with a maximum operating temperature of 125°C. Its 100V maximum voltage rating and surface-mount gull-wing termination suit compact, high-density PCB designs.
GS4B023090FFT Features
- Ceramic case for enhanced thermal and mechanical stability.
- Bussed network topology simplifies circuit design by connecting resistors in a common configuration.
- Precision thin-film resistors with ±1% tolerance and ±50ppm/°C TCR for minimal drift.
- SOIC package (4.9mm x 5.99mm x 1.45mm) with ±0.1mm length/height tolerances for consistent mounting.
- Gull-wing leads (1.27mm pitch) ensure reliable soldering in automated assembly.
- Non-automotive (PPAP No) and EU RoHS non-compliant, restricting use in certain regulated applications.
GS4B023090FFT Applications
This resistor network excels in:
- Voltage division and pull-up/down circuits in industrial control systems.
- Signal conditioning for sensors and ADCs in test/measurement equipment.
- Impedance matching in communication devices where stability is critical.
- High-density PCBs requiring space-saving, multi-resistor solutions.
- Non-RoHS compliant environments where ceramic durability is prioritized over environmental regulations.
Conclusion of GS4B023090FFT
The GS4B023090FFT stands out for its precision, compact SOIC footprint, and robust ceramic construction, making it a reliable choice for demanding electronics. While unsuitable for automotive or RoHS-regulated applications, its low TCR, tight tolerances, and bussed design offer superior performance in industrial, instrumentation, and communication systems. Engineers will appreciate its balance of thermal resilience, space efficiency, and circuit simplification in high-voltage, temperature-variable environments.



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