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GS4B023160FBT
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GS4B023160FBT Description
GS4B023160FBT Description
The GS4B023160FBT from TT Electronics/IRC is a high-precision 7-resistor thin film network designed for surface-mount applications requiring stable performance in demanding environments. Encased in a ceramic SOIC-8 package, it offers a 316Ω resistance per element with a tight 1% tolerance and a low ±50ppm/°C temperature coefficient, ensuring reliable operation across a -70°C to +125°C temperature range. With a 0.4W total power rating (0.05W per resistor) and 100V maximum voltage rating, this network is engineered for signal conditioning, voltage division, and impedance matching in compact PCB designs. Its gull-wing termination and 1.27mm pitch facilitate automated assembly, while the ceramic substrate enhances thermal stability.
GS4B023160FBT Features
- Precision Thin Film Technology: Delivers low noise and high stability for sensitive analog circuits.
- Robust Ceramic Package: Superior heat dissipation and mechanical durability vs. polymer-based arrays.
- BUS Circuit Design: Optimized for bus termination, pull-up/down networks, and multi-channel matching.
- Wide Operating Range: Derated power up to 125°C, suitable for industrial and automotive-grade prototypes (non-PPAP).
- Compact SOIC-8 Footprint: 4.9mm × 5.99mm × 1.45mm with tight tolerances (±0.1mm length/height) for high-density layouts.
- Non-RoHS (lead-containing): Preferred for legacy systems or applications exempt from RoHS restrictions.
GS4B023160FBT Applications
- Analog/Digital Hybrid Circuits: Precision voltage dividers in ADC/DAC interfaces.
- Industrial Controls: Signal conditioning in PLC I/O modules or sensor arrays.
- Telecom Infrastructure: Impedance matching for high-speed data lines (≤100V).
- Test & Measurement Equipment: Calibration networks requiring low TCR drift.
- Aerospace Prototyping: Ceramic construction resists thermal cycling in non-automotive harsh environments.
Conclusion of GS4B023160FBT
The GS4B023160FBT stands out for its ceramic-encased thin film resistors, combining precision, power efficiency, and thermal resilience in a space-saving SOIC format. While not RoHS-compliant, its 1% tolerance and ±50ppm/°C TCR make it ideal for mission-critical analog designs where stability outweighs lead-free mandates. A cost-effective solution for bus termination, industrial electronics, and legacy system upgrades, this network excels where competing polymer-based arrays may falter under thermal stress. Engineers should verify unconfirmed status for production use but can leverage its TT Electronics/IRC pedigree for prototyping and niche applications.



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