TT Electronics/IRC_GS4B023160FBT
original

TT Electronics/IRC
GS4B023160FBT

50-GS4B023160FBT
PDF Datasheet
Res Thin Film NET 316 Ohm 1% 0.4W ±50ppm/°C BUS Ceramic 8-Pin SOIC Gull Wing SMD Tube
30 weeks

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Tech Specifications

Circuit Designator
BUS
Number of Resistors
7
HTS
8533.21.00.20
Case Style
Ceramic
ECCN (US)
EAR99
Temperature Range @ Derated Power (°C)
70 to 125
PPAP
No
Automotive
No
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GS4B023160FBT Description

GS4B023160FBT Description

The GS4B023160FBT from TT Electronics/IRC is a high-precision 7-resistor thin film network designed for surface-mount applications requiring stable performance in demanding environments. Encased in a ceramic SOIC-8 package, it offers a 316Ω resistance per element with a tight 1% tolerance and a low ±50ppm/°C temperature coefficient, ensuring reliable operation across a -70°C to +125°C temperature range. With a 0.4W total power rating (0.05W per resistor) and 100V maximum voltage rating, this network is engineered for signal conditioning, voltage division, and impedance matching in compact PCB designs. Its gull-wing termination and 1.27mm pitch facilitate automated assembly, while the ceramic substrate enhances thermal stability.

GS4B023160FBT Features

  • Precision Thin Film Technology: Delivers low noise and high stability for sensitive analog circuits.
  • Robust Ceramic Package: Superior heat dissipation and mechanical durability vs. polymer-based arrays.
  • BUS Circuit Design: Optimized for bus termination, pull-up/down networks, and multi-channel matching.
  • Wide Operating Range: Derated power up to 125°C, suitable for industrial and automotive-grade prototypes (non-PPAP).
  • Compact SOIC-8 Footprint: 4.9mm × 5.99mm × 1.45mm with tight tolerances (±0.1mm length/height) for high-density layouts.
  • Non-RoHS (lead-containing): Preferred for legacy systems or applications exempt from RoHS restrictions.

GS4B023160FBT Applications

  • Analog/Digital Hybrid Circuits: Precision voltage dividers in ADC/DAC interfaces.
  • Industrial Controls: Signal conditioning in PLC I/O modules or sensor arrays.
  • Telecom Infrastructure: Impedance matching for high-speed data lines (≤100V).
  • Test & Measurement Equipment: Calibration networks requiring low TCR drift.
  • Aerospace Prototyping: Ceramic construction resists thermal cycling in non-automotive harsh environments.

Conclusion of GS4B023160FBT

The GS4B023160FBT stands out for its ceramic-encased thin film resistors, combining precision, power efficiency, and thermal resilience in a space-saving SOIC format. While not RoHS-compliant, its 1% tolerance and ±50ppm/°C TCR make it ideal for mission-critical analog designs where stability outweighs lead-free mandates. A cost-effective solution for bus termination, industrial electronics, and legacy system upgrades, this network excels where competing polymer-based arrays may falter under thermal stress. Engineers should verify unconfirmed status for production use but can leverage its TT Electronics/IRC pedigree for prototyping and niche applications.

FAQ

What voltage specification is listed for GS4B023160FBT?
The listed voltage-related specification for GS4B023160FBT is 100.
What is the mounting type of GS4B023160FBT?
What operating temperature range does GS4B023160FBT support?
What package or case is GS4B023160FBT available in?
What is GS4B023160FBT?
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