TT Electronics/IRC

GS4B023161DDT

GS4B023161DDT Description

The GS4B023161DDT from TT Electronics/IRC is a high-precision 7-resistor thin film network designed for BUS circuit applications. Encased in a ceramic SOIC-8 package, it delivers a 3.16KΩ resistance per element with an ultra-tight ±0.5% tolerance and a low ±50ppm/°C temperature coefficient, ensuring stability across a wide operating range of -70°C to +125°C. The device features gull-wing terminations for surface-mount (SMD) assembly, with a 0.4W total power rating (0.05W per resistor) and a 100V maximum voltage rating. Its compact dimensions (4.9mm × 5.99mm × 1.45mm) and ±0.1mm height tolerance make it ideal for space-constrained PCB designs.

GS4B023161DDT Features

• Precision Thin Film Technology: Delivers superior accuracy (±0.5%) and low TCR (±50ppm/°C) for stable performance in demanding environments.
• Robust Ceramic Package: Enhances thermal management and mechanical durability compared to polymer-based networks.
• High-Density Integration: 7 resistors in an 8-pin SOIC save board space versus discrete components.
• Automated Assembly-Friendly: Gull-wing leads and 1.27mm pitch enable reliable pick-and-place compatibility.
• Wide Temperature Range: Operates reliably from -70°C to +125°C, even at derated power.
• Non-Automotive (PPAP No): Suitable for industrial, telecom, and instrumentation applications where PPAP compliance isn’t required.

GS4B023161DDT Applications

• Voltage Division & Bus Termination: Ideal for CAN, I2C, or SPI buses requiring matched impedance and minimal drift.
• Precision Analog Circuits: Used in sensor interfaces, ADCs, and DACs where resistor matching is critical.
• Power Management Modules: Supports feedback networks in DC-DC converters or voltage references.
• Test & Measurement Equipment: Ensures signal integrity in oscilloscopes, multimeters, and data acquisition systems.
• Industrial Controls: Deployed in PLC I/O modules due to its rugged ceramic construction.

Conclusion of GS4B023161DDT

The GS4B023161DDT stands out for its combination of precision, power efficiency, and compactness, making it a superior choice over thicker-film or discrete alternatives in high-reliability electronics. Its ceramic SOIC package and thin film technology cater to applications demanding long-term stability under thermal stress, while its BUS-oriented design simplifies circuit layout. Though not RoHS-compliant, it remains a compelling option for industrial and telecom systems where performance outweighs regulatory constraints. Engineers seeking a cost-effective, space-saving resistor network with military-grade temperature resilience will find this model exceptionally versatile.