TT Electronics/IRC

GS4B023240JDT

GS4B023240JDT Description

The GS4B023240JDT from TT Electronics/IRC is a high-performance 7-resistor bussed network in an 8-pin narrow SOIC package, designed for precision applications requiring stable thin-film technology. With a 324Ω resistance value and ±5% absolute tolerance, it ensures reliable performance in demanding circuits. The ceramic-based construction enhances thermal stability, supporting operation from 70°C to 125°C with a ±50ppm/°C temperature coefficient. Its 0.4W total power rating (0.05W per resistor) and 100V maximum voltage rating make it suitable for low-power, high-voltage environments. The gull-wing termination and surface-mount design facilitate easy PCB integration.

GS4B023240JDT Features

• Bussed Network: 7 resistors connected in a bus configuration, simplifying circuit design.
• Thin-Film Technology: Delivers superior accuracy (±5% tolerance) and low TCR (±50ppm/°C).
• Robust Construction: Ceramic case ensures durability and thermal performance.
• Compact SOIC Package: 4.9mm × 5.99mm footprint with 1.27mm terminal pitch, ideal for space-constrained layouts.
• Wide Temperature Range: Operates reliably up to 125°C, derated for high-temperature environments.
• Non-Automotive: Suitable for industrial and commercial applications where PPAP compliance is not required.

GS4B023240JDT Applications

This resistor network excels in:

• Voltage Division Circuits: Precision dividers in measurement equipment.
• Signal Conditioning: Buffering or termination in communication systems.
• Industrial Control Systems: Stable performance in PLCs and sensor interfaces.
• Power Management: Low-power distribution in DC-DC converters.
• Test & Measurement: Calibration circuits requiring tight ratio tolerance (±0.5%).

Conclusion of GS4B023240JDT

The GS4B023240JDT combines precision, compactness, and thermal resilience, making it a standout choice for engineers needing reliable resistor networks in industrial and commercial electronics. Its thin-film technology, bussed design, and SOIC packaging offer a balanced solution for applications demanding stability and space efficiency. While not RoHS-compliant, its performance in harsh conditions justifies its use in specialized sectors.