TT Electronics/IRC

GS4B023300GGT

GS4B023300GGT Description

The GS4B023300GGT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications in demanding electronic circuits. This 7-resistor bussed network features a 330Ω resistance value per element with an absolute tolerance of ±2% and a ratio tolerance of ±2%. Encased in an 8-pin narrow SOIC (SOIC-C) package, it utilizes thin-film technology for stable performance across a wide temperature range of -70°C to +125°C. The device offers a power rating of 0.4W (0.05W per resistor) and operates at a maximum voltage of 100V, making it suitable for low-power, high-density designs. Its ±50ppm/°C temperature coefficient ensures minimal resistance drift, while the gull-wing termination facilitates reliable surface-mount assembly.

GS4B023300GGT Features

• Ceramic substrate for enhanced thermal stability and durability.
• Bussed circuit design simplifies PCB layout in bus-oriented applications.
• Thin-film technology delivers superior precision and low noise.
• Narrow SOIC package (4.9mm x 5.99mm x 1.45mm) saves board space.
• Wide operating temperature range (-70°C to +125°C) for harsh environments.
• Low TCR (±50ppm/°C) minimizes resistance variation with temperature.
• 2% tolerance ensures consistent performance in precision circuits.
• Gull-wing leads enable robust surface-mount soldering.

GS4B023300GGT Applications

Ideal for industrial, telecommunications, and instrumentation systems, the GS4B023300GGT excels in:

• Voltage divider networks requiring tight tolerance matching.
• Bus termination in high-speed digital circuits (e.g., memory interfaces).
• Signal conditioning in sensor arrays and data acquisition systems.
• Embedded control systems where space and reliability are critical.
• Automotive electronics (non-automotive grade but suitable for benign environments).

Conclusion of GS4B023300GGT

The GS4B023300GGT combines precision, compactness, and thermal resilience, making it a standout choice for engineers designing high-reliability, space-constrained applications. Its ceramic construction, tight tolerances, and bussed architecture offer distinct advantages over polymer-based networks, particularly in thermal management and long-term stability. While not PPAP or automotive-qualified, it remains a robust solution for industrial and commercial electronics demanding consistent performance under varying conditions.