TT Electronics/IRC

GS4B023302BBT

GS4B023302BBT Description

The GS4B023302BBT from TT Electronics/IRC is a high-precision 7-resistor thin film network designed for surface-mount applications. Encased in an 8-pin SOIC ceramic package, it features a 33K Ohm resistance per element with an ultra-tight 0.1% tolerance and a low ±50ppm/°C temperature coefficient, ensuring stability across a wide operating range (70°C to 125°C). The 0.4W total power rating (0.05W per resistor) and 100V maximum voltage rating make it suitable for demanding circuits. Its gull-wing termination and 1.27mm pitch facilitate reliable PCB mounting, while the ceramic substrate enhances thermal performance.

GS4B023302BBT Features

• Precision Thin Film Technology: Delivers 0.1% tolerance and ±50ppm/°C TCR for critical analog/digital systems.
• Robust Construction: Ceramic case ensures durability and heat dissipation, ideal for high-temperature environments.
• Space-Efficient Design: 4.9mm × 5.99mm × 1.45mm (L×D×H) with ±0.1mm dimensional tolerances for compact layouts.
• Automated Assembly Compatibility: Gull-wing leads and SOIC package align with high-volume SMD processes.
• Non-Automotive/Non-PPAP: Optimized for industrial, telecom, and instrumentation use.

GS4B023302BBT Applications

• Voltage Division/Current Sensing: Precision networks in DAQ systems, ADCs, and op-amp circuits.
• Signal Conditioning: Stable performance in medical devices, test equipment, and communication hardware.
• Power Management: BUS line termination or pull-up/down networks in FPGA/ASIC designs.
• Aerospace/Defense: Reliable operation in avionics and ruggedized electronics due to ceramic robustness.

Conclusion of GS4B023302BBT

The GS4B023302BBT excels in high-accuracy, thermally stable applications, offering superior performance over standard thick-film networks. Its ceramic SOIC package, thin film precision, and industrial-grade specs make it a top choice for engineers prioritizing long-term reliability and signal integrity. While not PPAP-capable, it is ideal for prototyping, instrumentation, and embedded systems where precision outweighs automotive compliance.