TT Electronics/IRC_GS4B023571GGT
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TT Electronics/IRC
GS4B023571GGT

50-GS4B023571GGT
PDF Datasheet
Ceramic Resistor Network, SOIC-C Series,8-Pin Narrow SOIC, Bussed elements,±50ppm/°C, 3.57KOhm, absolute tolerance ±2%, ratio tolerance ±2%
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Tech Specifications

Circuit Designator
BUS
Number of Resistors
7
HTS
8533.21.00.20
Case Style
Ceramic
ECCN (US)
EAR99
Temperature Range @ Derated Power (°C)
70 to 125
PPAP
No
Automotive
No
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GS4B023571GGT Description

GS4B023571GGT Description

The GS4B023571GGT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications. This 8-pin Narrow SOIC (SOIC-C Series) device features 7 bussed resistors with a 3.57KΩ resistance value and a tight ±2% absolute tolerance, ensuring consistent performance in demanding circuits. Built with thin-film technology, it offers excellent stability with a ±50ppm/°C temperature coefficient, making it suitable for environments with fluctuating temperatures. The SOIC package (4.9mm x 5.99mm x 1.45mm) is optimized for surface-mount applications, with gull-wing terminations for reliable PCB connections. Rated for 100V maximum voltage and 0.4W total power dissipation, it operates reliably within a 70°C to 125°C derated power range, peaking at 125°C maximum operating temperature.

GS4B023571GGT Features

  • Ceramic substrate for enhanced thermal and mechanical stability.
  • Bussed network (BUS designator) simplifies circuit design by interconnecting resistors.
  • Low TCR (±50ppm/°C) ensures minimal resistance drift under temperature variations.
  • High power rating (0.4W total, 0.05W per resistor) for robust performance.
  • Precision tolerance (±2% absolute, ±2% ratio) for critical analog/digital applications.
  • Narrow SOIC package (8-pin) saves board space while maintaining durability.
  • Gull-wing termination improves solder joint reliability in automated assembly.
  • Non-automotive (PPAP: No) but suitable for industrial and telecom applications.

GS4B023571GGT Applications

This resistor network excels in:

  • Voltage dividers and pull-up/pull-down networks in precision analog circuits.
  • Signal conditioning for sensors, ADCs, and DACs in measurement equipment.
  • Industrial control systems requiring stable resistance under thermal stress.
  • Telecommunication infrastructure (e.g., line termination, impedance matching).
  • Power management circuits where low TCR and tight tolerance are critical.

Conclusion of GS4B023571GGT

The GS4B023571GGT combines thin-film precision, ceramic robustness, and compact SOIC packaging to deliver reliable performance in high-accuracy applications. Its bussed architecture reduces component count, while its ±50ppm/°C TCR and 2% tolerance make it ideal for environments demanding stability. Though not PPAP-compliant, it is a cost-effective solution for industrial, telecom, and instrumentation designs where space and performance are paramount.

FAQ

What is the mounting type of GS4B023571GGT?
GS4B023571GGT uses a Surface Mount mounting style based on the listed product specifications.
What operating temperature range does GS4B023571GGT support?
What is the standard lead time for GS4B023571GGT?
Are there related or alternative parts for GS4B023571GGT?
What voltage specification is listed for GS4B023571GGT?
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