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GS4B023571GGT
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GS4B023571GGT Description
GS4B023571GGT Description
The GS4B023571GGT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications. This 8-pin Narrow SOIC (SOIC-C Series) device features 7 bussed resistors with a 3.57KΩ resistance value and a tight ±2% absolute tolerance, ensuring consistent performance in demanding circuits. Built with thin-film technology, it offers excellent stability with a ±50ppm/°C temperature coefficient, making it suitable for environments with fluctuating temperatures. The SOIC package (4.9mm x 5.99mm x 1.45mm) is optimized for surface-mount applications, with gull-wing terminations for reliable PCB connections. Rated for 100V maximum voltage and 0.4W total power dissipation, it operates reliably within a 70°C to 125°C derated power range, peaking at 125°C maximum operating temperature.
GS4B023571GGT Features
- Ceramic substrate for enhanced thermal and mechanical stability.
- Bussed network (BUS designator) simplifies circuit design by interconnecting resistors.
- Low TCR (±50ppm/°C) ensures minimal resistance drift under temperature variations.
- High power rating (0.4W total, 0.05W per resistor) for robust performance.
- Precision tolerance (±2% absolute, ±2% ratio) for critical analog/digital applications.
- Narrow SOIC package (8-pin) saves board space while maintaining durability.
- Gull-wing termination improves solder joint reliability in automated assembly.
- Non-automotive (PPAP: No) but suitable for industrial and telecom applications.
GS4B023571GGT Applications
This resistor network excels in:
- Voltage dividers and pull-up/pull-down networks in precision analog circuits.
- Signal conditioning for sensors, ADCs, and DACs in measurement equipment.
- Industrial control systems requiring stable resistance under thermal stress.
- Telecommunication infrastructure (e.g., line termination, impedance matching).
- Power management circuits where low TCR and tight tolerance are critical.
Conclusion of GS4B023571GGT
The GS4B023571GGT combines thin-film precision, ceramic robustness, and compact SOIC packaging to deliver reliable performance in high-accuracy applications. Its bussed architecture reduces component count, while its ±50ppm/°C TCR and 2% tolerance make it ideal for environments demanding stability. Though not PPAP-compliant, it is a cost-effective solution for industrial, telecom, and instrumentation designs where space and performance are paramount.



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