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GS4B023572FBT
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GS4B023572FBT Description
GS4B023572FBT Description
The GS4B023572FBT from TT Electronics/IRC is a high-precision 7-resistor bussed network in an 8-pin narrow SOIC package, designed for demanding surface-mount applications. This ceramic-based thin-film resistor array offers a 35.7KΩ resistance per element with an absolute tolerance of ±1% and an exceptional ratio tolerance of ±0.1%, ensuring consistent performance in precision circuits. Its ±50ppm/°C temperature coefficient and 125°C maximum operating temperature make it suitable for environments with thermal fluctuations. The SOIC-C series construction provides robust mechanical stability, while the gull-wing termination ensures reliable solder joints. With a 100V maximum voltage rating and 0.4W total power dissipation, it balances compactness with durability.
GS4B023572FBT Features
- Bussed Network Design: Simplifies PCB layout by reducing discrete component count.
- High Precision: ±1% absolute tolerance and ±0.1% ratio tolerance for matched resistance values.
- Stable Performance: Thin-film technology with ±50ppm/°C TCR ensures minimal drift.
- Robust Construction: Ceramic case and SOIC package (4.9mm × 5.99mm × 1.45mm) with ±0.1mm dimensional tolerances.
- Wide Temperature Range: Operates from 70°C to 125°C with derated power handling.
- Surface-Mount Ready: Gull-wing terminals with 1.27mm pitch for automated assembly.
- Non-Automotive/Non-PPAP: Ideal for industrial, telecom, and instrumentation applications.
GS4B023572FBT Applications
- Voltage Dividers: Precision ratio tolerance ensures accurate signal conditioning.
- ADC/DAC Circuits: Stable resistance values critical for analog-to-digital conversion.
- Industrial Control Systems: Reliable performance in harsh environments.
- Medical Electronics: Low drift and high accuracy for sensitive measurements.
- Telecom Infrastructure: Compact footprint suits high-density PCBs in base stations.
Conclusion of GS4B023572FBT
The GS4B023572FBT excels in applications requiring tight tolerance, thermal stability, and space efficiency. Its ceramic thin-film construction and bussed architecture reduce design complexity while maintaining precision. Though not PPAP or automotive-qualified, it is a cost-effective solution for industrial, medical, and telecom systems where reliability and accuracy are paramount. Engineers will appreciate its balance of performance, compactness, and ease of integration.



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