TT Electronics/IRC

GS4B023572JDT

GS4B023572JDT Description

The GS4B023572JDT from TT Electronics/IRC is a high-performance 7-resistor bussed network in an 8-pin narrow SOIC package, designed for precision applications requiring stable thin-film resistance. With a 35.7KΩ resistance per element and a ±5% absolute tolerance, this ceramic-based network ensures reliable performance in demanding environments. Its ±50ppm/°C temperature coefficient and 125°C maximum operating temperature make it suitable for thermally challenging circuits. The SOIC-C series construction offers a compact footprint (4.9mm × 5.99mm × 1.45mm) with gull-wing termination for robust surface-mount assembly. Rated at 0.4W total power (0.05W per resistor) and 100V maximum voltage, it balances power handling with miniaturization.

GS4B023572JDT Features

• Bussed Network Design: Simplifies PCB layout by connecting resistors in a shared topology, reducing component count.
• Thin-Film Technology: Delivers superior stability, low noise, and tight ±0.5% ratio tolerance for matched resistance pairs.
• Ceramic Case: Enhances thermal dissipation and mechanical durability compared to polymer-based networks.
• Wide Temperature Range: Operates from 70°C to 125°C with derated power, ideal for industrial and automotive-adjacent systems (though not PPAP/automotive-certified).
• Precision Gull-Wing Terminals: Ensures reliable solder joints with a 1.27mm pitch for high-density boards.
• Non-RoHS Compliance: Suitable for legacy or specialized applications exempt from RoHS restrictions.

GS4B023572JDT Applications

• Voltage Divider Networks: Precision dividers in sensor interfaces or ADC reference circuits.
• Bus Termination: Impedance matching for data lines in communication hardware.
• Industrial Controls: Stable resistance in PLCs, motor drives, and power supplies.
• Test & Measurement Equipment: High-accuracy signal conditioning due to low TCR and tight tolerances.
• Legacy Electronics: Repair or replication of non-RoHS-compliant systems.

Conclusion of GS4B023572JDT

The GS4B023572JDT excels in applications demanding miniaturization, thermal resilience, and electrical precision. Its ceramic SOIC package and thin-film construction provide a competitive edge over epoxy-based networks, particularly in high-temperature or vibration-prone environments. While not suited for automotive use, its bussed design and low TCR make it a versatile choice for industrial, telecom, and instrumentation designs. Engineers will appreciate its balance of performance, durability, and space efficiency in complex circuit architectures.