TT Electronics/IRC

GS4B023601FT

GS4B023601FT Description

The GS4B023601FT from TT Electronics/IRC is a high-performance 7-resistor bussed network in an 8-pin narrow SOIC package. Designed with thin-film technology on a ceramic substrate, it delivers precision resistance values of 3.6KΩ with a tight ±1% tolerance and a low ±50ppm/°C temperature coefficient. The device operates over a wide temperature range (-70°C to +125°C) and supports a maximum voltage rating of 100V, making it suitable for demanding environments. Its SOIC-C series construction ensures reliability in surface-mount applications, with a compact footprint (4.9mm length × 5.99mm depth × 1.45mm height) and gull-wing termination for secure PCB attachment.

GS4B023601FT Features

• Precision Network: 7 bussed resistors with 3.6KΩ ±1% tolerance for consistent performance.
• Stable Thermal Performance: ±50ppm/°C TCR ensures minimal drift across operating temperatures.
• Robust Construction: Ceramic case and thin-film technology enhance durability and heat dissipation.
• High Power Handling: 0.4W total power rating (0.05W per resistor) for distributed load applications.
• Automation-Friendly: Gull-wing leads and 1.27mm pitch simplify pick-and-place assembly.
• Wide Voltage Range: Supports up to 100V, ideal for industrial and instrumentation circuits.

GS4B023601FT Applications

This resistor network excels in:

• Voltage Division Circuits: Precision dividers in sensor interfaces or ADC front-ends.
• Bus Termination: Stable impedance matching in communication buses (e.g., CAN, SPI).
• Industrial Control Systems: Reliable performance in PLC modules or motor drivers.
• Test & Measurement Equipment: Low-drift resistance for calibration and signal conditioning.
• Power Management: Auxiliary circuits in DC-DC converters or load-sharing designs.

Conclusion of GS4B023601FT

The GS4B023601FT combines precision, thermal stability, and compact packaging, making it a superior choice for applications requiring tight-tolerance bussed networks. Its ceramic SOIC-C design outperforms polymer-based alternatives in high-temperature environments, while the thin-film technology ensures long-term reliability. Engineers will value its ease of integration and consistent performance in critical analog and mixed-signal designs.

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