


TT Electronics/IRC
GS4B023651FT
Why Choose Us?
Professional Platform
B2B & B2C purchasingDelivery at full speed
1-2 days deliveryWide variety
Original manufacturers365 days guarantee
Responsible qualityTech Specifications
GS4B023651FT Description
GS4B023651FT Description
The GS4B023651FT from TT Electronics/IRC is a high-performance 7-resistor bussed network in an 8-pin narrow SOIC package, designed for precision applications requiring stable thin-film resistance. With a 3.65KΩ resistance per element and a tight ±1% tolerance, this ceramic-based network ensures reliable performance in demanding environments. Its ±50ppm/°C temperature coefficient and 125°C maximum operating temperature make it suitable for thermally challenging circuits. The SOIC-C series construction features gull-wing terminations for robust surface-mount assembly, while the 0.4W total power rating (0.05W per resistor) balances compactness with thermal dissipation.
GS4B023651FT Features
- Bussed Network Design: 7 resistors interconnected in a bus configuration, simplifying PCB layout for common-node applications.
- Ceramic Substrate: Enhances thermal stability and durability compared to polymer-based networks.
- Precision Thin Film: Delivers low noise and high accuracy (±1%) with a ±50ppm/°C TCR for minimal drift.
- Robust Packaging: 8-pin SOIC (4.9mm × 5.99mm × 1.45mm) with gull-wing leads for reliable SMT soldering.
- Wide Voltage Range: Supports up to 100V, ideal for industrial and instrumentation circuits.
- Non-Automotive Grade: Optimized for general-purpose use, though not PPAP-capable.
GS4B023651FT Applications
- Signal Conditioning: Precision voltage dividers or pull-up/down networks in ADC/DAC circuits.
- Industrial Controls: Durable performance in PLCs, motor drives, and power supplies.
- Test & Measurement Equipment: Stable resistance for calibration and reference circuits.
- Consumer Electronics: Space-constrained designs needing reliable bussed resistors (e.g., audio hardware).
Conclusion of GS4B023651FT
The GS4B023651FT excels in applications demanding compactness, precision, and thermal resilience. Its ceramic construction and thin-film technology offer superior stability over standard thick-film networks, while the bussed design reduces component count. Though not RoHS-compliant or automotive-rated, it is a cost-effective solution for industrial and consumer electronics where tight tolerances and moderate power handling are critical. Engineers will value its balance of performance and ease of integration in high-density PCBs.



.png)














.png?x-oss-process=image/format,webp/resize,h_32)










