TT Electronics/IRC

GS4B023741GDT

GS4B023741GDT Description

The GS4B023741GDT from TT Electronics/IRC is a high-performance 7-resistor bussed network in an 8-pin narrow SOIC package, designed for precision applications requiring stable thin-film resistance. Encased in a ceramic SOIC-C series housing, it offers a 3.74KΩ resistance per element with a tight ±2% absolute tolerance and ±0.5% ratio tolerance, ensuring consistent performance in matched circuits. The thin-film technology and ±50ppm/°C temperature coefficient provide excellent thermal stability across a 70°C to 125°C derated power range, with a maximum operating temperature of 125°C. Its 0.05W (1/20) power rating per resistor and 0.4W total power handling make it suitable for low-power, high-density designs.

GS4B023741GDT Features

• Ceramic Construction: Enhances thermal management and durability in harsh environments.
• Bussed Network (BUS): Simplifies circuit design by connecting multiple resistors to a common node.
• Precision Tolerance: ±2% absolute and ±0.5% ratio tolerance for matched resistance values.
• Low TCR: ±50ppm/°C ensures minimal resistance drift over temperature.
• Surface-Mount Gull Wing Terminals: Facilitates automated PCB assembly with a 1.27mm pitch.
• Compact Dimensions: 4.9mm (L) × 5.99mm (D) × 1.45mm (H) with tight tolerances (±0.1mm height/length, ±0.2mm depth).
• 100V Maximum Voltage Rating: Suitable for low-to-medium voltage applications.

GS4B023741GDT Applications

Ideal for precision analog circuits, voltage dividers, and signal conditioning in:

• Industrial Control Systems: Where stable resistance ratios are critical for sensor interfacing.
• Medical Electronics: Low-noise, high-reliability requirements in diagnostic equipment.
• Automotive (Non-Automotive Rated): Auxiliary systems needing robust ceramic packaging.
• Test & Measurement Equipment: Calibration circuits demanding tight tolerance networks.

Conclusion of GS4B023741GDT

The GS4B023741GDT excels in applications requiring matched resistance values, thermal stability, and compact form factors. Its ceramic SOIC package, bussed design, and thin-film technology offer superior performance over polymer-based networks, particularly in environments with fluctuating temperatures. While not PPAP or automotive-qualified, it is a cost-effective solution for industrial and medical electronics where precision and reliability are paramount.