TT Electronics/IRC

GS4B023901JFT

GS4B023901JFT Description

The GS4B023901JFT from TT Electronics/IRC is a high-performance 7-resistor bussed network in an 8-pin narrow SOIC (SOIC-C) ceramic package. Designed for precision applications, it features a 3.9KΩ resistance value with an absolute tolerance of ±5% and a ratio tolerance of ±1%, ensuring consistent performance in matched-resistor circuits. The thin-film technology delivers a low temperature coefficient of ±50ppm/°C, maintaining stability across a wide operating range of -55°C to +125°C. With a power rating of 0.4W (0.05W per resistor) and a maximum voltage rating of 100V, this network is engineered for reliability in demanding environments. Its gull-wing termination and surface-mount design facilitate easy PCB integration.

GS4B023901JFT Features

• Ceramic Case (SOIC-C): Enhances thermal and mechanical durability.
• Bussed Network (BUS): Simplifies circuit design by interconnecting resistors.
• Thin-Film Technology: Delivers precision (±5% tolerance) and low TCR (±50ppm/°C).
• High Power Handling: 0.4W total (0.05W per resistor) at 70°C derating.
• Compact Dimensions: 4.9mm (L) × 5.99mm (D) × 1.45mm (H) with tight tolerances (±0.1mm).
• Wide Temperature Range: Operates from -55°C to +125°C, suitable for industrial applications.
• Non-Automotive (PPAP No): Ideal for industrial, telecom, and instrumentation use.

GS4B023901JFT Applications

This resistor network excels in:

• Voltage Divider Circuits: Precision ratio tolerance (±1%) ensures accurate signal conditioning.
• Analog Signal Processing: Stable TCR minimizes drift in feedback networks.
• Industrial Control Systems: Ceramic construction withstands harsh environments.
• Telecom Infrastructure: Compact SOIC footprint saves board space in high-density designs.
• Test & Measurement Equipment: Low noise and high voltage tolerance (100V) support precision instrumentation.

Conclusion of GS4B023901JFT

The GS4B023901JFT combines precision, durability, and compactness, making it a superior choice for applications requiring stable resistance networks. Its ceramic SOIC package, bussed design, and thin-film technology offer distinct advantages over polymer-based or discrete alternatives. While not RoHS-compliant, it remains a robust solution for industrial and telecom systems where reliability under thermal stress is critical. Engineers will appreciate its ease of integration and consistent performance in matched-resistor configurations.