TT Electronics/IRC

GS4B024022FFT

GS4B024022FFT Description

The GS4B024022FFT from TT Electronics/IRC is a high-performance 7-resistor bussed network in an 8-pin narrow SOIC package, designed for precision applications requiring stable thin-film technology. Encased in a ceramic substrate, it delivers superior thermal stability with a ±50ppm/°C temperature coefficient and 1% absolute tolerance. Rated for 40.2KΩ resistance per element, it operates at 0.05W (1/20W) per resistor (0.4W total) and withstands voltages up to 100V. Its SOIC-C series construction ensures reliability in harsh environments, with an operating temperature range of 70°C to 125°C. The gull-wing termination and surface-mount design facilitate automated assembly, while its compact dimensions (4.9mm × 5.99mm × 1.45mm) save PCB space.

GS4B024022FFT Features

• Ceramic Case: Enhances thermal dissipation and mechanical robustness.
• Thin-Film Technology: Delivers low noise and high precision (±1% tolerance).
• Bussed Configuration: Simplifies circuit design for common-node applications.
• Wide Temperature Range: Stable performance from 70°C to 125°C (derated power).
• Automation-Friendly: Gull-wing leads and 1.27mm pitch for seamless SMT integration.
• High Voltage Rating: 100V maximum for industrial and telecom applications.
• Non-Automotive: Suitable for non-PPAP commercial/industrial use.

GS4B024022FFT Applications

Ideal for:

• Voltage Divider Networks: Precision signal conditioning in test equipment.
• Industrial Controls: PLCs, sensor interfaces, and power management.
• Telecom Infrastructure: Line termination and impedance matching.
• Medical Devices: Low-drift circuits requiring stable resistance.
• Aerospace & Defense: Harsh-environment electronics due to ceramic durability.

Conclusion of GS4B024022FFT

The GS4B024022FFT excels in precision, thermal stability, and space efficiency, making it a top choice for high-reliability commercial and industrial designs. Its ceramic construction and thin-film resistors outperform plastic-cased networks in thermal stress scenarios, while the bussed architecture reduces component count. Though not PPAP-capable, it’s a cost-effective solution for non-automotive applications demanding tight tolerances and robust performance.