
TT Electronics/IRC
GS4B024221GFT
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GS4B024221GFT Description
GS4B024221GFT Description
The GS4B024221GFT from TT Electronics/IRC is a high-precision 7-resistor bussed network in an 8-pin narrow SOIC package. Designed for surface-mount applications, it features a 4.22KΩ resistance per element with a tight ±2% absolute tolerance and ±1% ratio tolerance, ensuring consistent performance in precision circuits. The network utilizes thin-film technology on a ceramic substrate, delivering excellent stability with a low ±50ppm/°C temperature coefficient. Rated for 0.05W (1/20W) per resistor and 0.4W total power dissipation, it operates reliably across a wide temperature range of -70°C to +125°C, making it suitable for demanding environments.
GS4B024221GFT Features
- Bussed Network Design: 7 resistors connected in a common bus configuration, simplifying PCB layout.
- High Precision: ±2% absolute tolerance and ±1% ratio tolerance for matched resistance values.
- Robust Construction: Ceramic case with gull-wing termination ensures durability and solderability.
- Wide Operating Range: Derated power up to 125°C, with a 100V maximum voltage rating.
- Compact Footprint: 4.9mm (L) × 5.99mm (D) × 1.45mm (H) SOIC package, ideal for space-constrained designs.
- Low TCR: ±50ppm/°C ensures minimal resistance drift over temperature variations.
GS4B024221GFT Applications
This resistor network excels in precision analog circuits, voltage dividers, and sensor signal conditioning where matched resistances are critical. Its bussed topology is ideal for bus termination, pull-up/pull-down networks, and I/O port protection in industrial control systems, test equipment, and communication devices. The thin-film technology and ceramic substrate make it suitable for high-frequency applications, while its wide temperature range supports automotive (non-AECQ) and aerospace subsystems.
Conclusion of GS4B024221GFT
The GS4B024221GFT combines precision, compactness, and thermal stability, offering superior performance in matched-resistance applications. Its bussed design reduces component count, while the SOIC package ensures compatibility with automated assembly. Though not PPAP or automotive-qualified, it remains a cost-effective solution for industrial and instrumentation designs requiring reliable, high-density resistor networks.



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