TT Electronics/IRC

GS4B024301JFT

GS4B024301JFT Description

The GS4B024301JFT from TT Electronics/IRC is a high-performance 7-resistor bussed network in an 8-pin narrow SOIC package, designed for precision applications requiring stable thin-film resistance. Encased in a ceramic substrate, it offers superior thermal stability with a ±50ppm/°C temperature coefficient and operates across a 70°C to 125°C derated power range, peaking at 125°C maximum. Each resistor features a 4.3KΩ ±5% tolerance and handles 0.05W (1/20W) per element, with a collective 0.4W power rating and 100V maximum voltage. Its gull-wing termination and 1.27mm pitch ensure compatibility with standard SMT processes, while the SOIC-C series construction provides mechanical robustness.

GS4B024301JFT Features

• Ceramic Case: Enhances thermal dissipation and durability in harsh environments.
• Bussed Network (BUS): Simplifies circuit design by interconnecting resistors, reducing component count.
• Thin-Film Technology: Delivers tight ratio tolerance (±1%) and low noise for precision analog/digital circuits.
• Compact Dimensions: 4.9mm (L) × 5.99mm (D) × 1.45mm (H) with tight tolerances (±0.1mm height/length).
• Wide Operating Range: Stable performance from -55°C to +125°C (full range) with derating up to 125°C.
• Non-Automotive Grade: Ideal for industrial and consumer electronics where PPAP compliance isn’t required.

GS4B024301JFT Applications

• Voltage Divider Networks: Precision attenuation in sensor interfaces or ADC front-ends.
• Pull-Up/Pull-Down Arrays: Simplifies logic level conditioning in microcontrollers and FPGAs.
• Industrial Control Systems: Reliable performance in PLCs, motor drives, and power supplies.
• Test & Measurement Equipment: Low-drift resistance for calibration circuits.
• Consumer Electronics: Space-constrained designs like smart home devices, leveraging its SOIC footprint.

Conclusion of GS4B024301JFT

The GS4B024301JFT excels in precision, thermal stability, and space efficiency, making it a standout choice for bussed resistor networks. Its ceramic construction and thin-film technology outperform polymer-based alternatives in high-temperature scenarios, while the 5% absolute tolerance and 1% ratio tolerance ensure consistent signal integrity. Though not RoHS-compliant, it remains a robust solution for industrial and embedded systems demanding reliability without automotive-grade overhead. Engineers will value its drop-in compatibility with SOIC layouts and simplified BUS topology for streamlined designs.