TT Electronics/IRC

GS4B024701JT

GS4B024701JT Description

The GS4B024701JT from TT Electronics/IRC is a high-performance 7-resistor bussed network in an 8-pin narrow SOIC package, designed for precision surface-mount applications. This ceramic-based thin-film resistor network offers a 4.7KΩ resistance per element with a ±5% tolerance and a low ±50ppm/°C temperature coefficient, ensuring stable performance across a wide operating temperature range of 70°C to 125°C. With a 0.05W (1/20) power rating per resistor and a total power rating of 0.4W, it balances compactness with reliable power dissipation. The SOIC-C series construction features gull-wing terminations for secure PCB mounting, and its 100V maximum voltage rating makes it suitable for moderate-voltage circuits.

GS4B024701JT Features

• Bussed Network Design: Simplifies circuit layout with a shared common node (BUS) for streamlined connections.
• High-Temperature Stability: Operates reliably up to 125°C with derated power handling.
• Precision Thin-Film Technology: Delivers low TCR (±50ppm/°C) and tight tolerance (±5%) for critical analog/digital circuits.
• Robust Ceramic Substrate: Enhances thermal and mechanical durability compared to polymer-based networks.
• Compact SOIC Package: 4.9mm × 5.99mm footprint and 1.45mm profile save board space in dense layouts.
• Automotive-Grade Alternatives: While not PPAP/automotive-certified, its performance suits industrial and consumer electronics.

GS4B024701JT Applications

Ideal for voltage division, pull-up/pull-down networks, and bus termination in:

• Embedded Systems: Signal conditioning in microcontrollers and FPGAs.
• Power Management: Load sharing in DC-DC converters.
• Test & Measurement Equipment: Precision reference circuits.
• Industrial Controls: Robust performance in harsh environments.
• Consumer Electronics: Space-constrained designs like IoT devices.

Conclusion of GS4B024701JT

The GS4B024701JT excels in compact, high-reliability applications requiring stable resistance values under thermal stress. Its ceramic construction, bussed architecture, and thin-film precision make it a superior choice over epoxy-based networks in demanding environments. While not RoHS-compliant, it remains a cost-effective solution for non-automotive designs prioritizing durability and electrical consistency. Engineers will appreciate its balance of performance, size, and ease of integration in modern SMT assemblies.