TT Electronics/IRC

GS4B024751DDT

GS4B024751DDT Description

The GS4B024751DDT from TT Electronics/IRC is a high-precision 7-resistor thin-film network designed for demanding circuit applications. Housed in an 8-pin SOIC ceramic package, it offers a 4.75KΩ resistance per resistor with a tight ±0.5% tolerance and a low ±50ppm/°C temperature coefficient, ensuring stability across a 70°C to 125°C operating range. Rated for 0.4W total power dissipation (0.05W per resistor) and 100V maximum voltage, this surface-mount (SMD) network features gull-wing terminations for reliable PCB connections. Its ceramic case enhances thermal performance, while the 1.27mm terminal pitch accommodates high-density layouts.

GS4B024751DDT Features

• Precision Thin Film Technology: Delivers low noise and high accuracy for signal conditioning.
• Robust Ceramic Package: Superior heat dissipation and mechanical durability vs. plastic alternatives.
• BUS Circuit Designator: Optimized for bus termination, pull-up/pull-down networks, and voltage dividers.
• Stable Performance: ±50ppm/°C TCR and 0.5% tolerance ensure reliability in automotive-grade (non-PPAP) and industrial environments.
• Compact SOIC Footprint: 4.9mm × 5.99mm × 1.45mm dimensions with ±0.1mm height tolerance for space-constrained designs.

GS4B024751DDT Applications

Ideal for:

• Analog/Digital Signal Processing: Precision voltage division in ADCs, DACs, and sensor interfaces.
• Bus Termination Networks: I²C, SPI, or CAN bus impedance matching to reduce reflections.
• Power Management Circuits: Feedback networks in DC-DC converters or LDO regulators.
• Industrial Controls: PLC modules requiring stable resistance under thermal stress.
• Test & Measurement Equipment: Calibration circuits demanding low drift over temperature.

Conclusion of GS4B024751DDT

The GS4B024751DDT stands out for its ceramic-encased thin-film resistors, combining precision, thermal resilience, and compactness. While non-RoHS compliant, its 0.5% tolerance and ±50ppm/°C TCR make it a top choice for high-reliability applications where performance outweighs regulatory restrictions. Its SOIC gull-wing package ensures compatibility with automated assembly, catering to industrial, telecom, and instrumentation designs requiring repeatable accuracy.