TT Electronics/IRC

GS4B024751GDT

GS4B024751GDT Description

The GS4B024751GDT from TT Electronics/IRC is a high-performance 7-resistor bussed network in an 8-pin narrow SOIC package. Designed with thin-film technology on a ceramic substrate, it delivers precision resistance values of 4.75KΩ with a tight ±2% absolute tolerance and ±0.5% ratio tolerance. The device operates over a wide temperature range (70°C to 125°C) with a ±50ppm/°C temperature coefficient, ensuring stability in demanding environments. Its SOIC-C series construction features gull-wing terminations for reliable surface-mount (SMD) assembly, and the 0.05W (1/20) power rating per resistor (0.4W total) supports low-power applications. With a 100V maximum voltage rating, it is suitable for industrial and instrumentation circuits requiring consistent performance.

GS4B024751GDT Features

• Ceramic case for enhanced thermal and mechanical durability.
• Bussed (BUS) topology simplifies circuit design by interconnecting resistors.
• Precision thin-film technology ensures low noise and high accuracy (±2% tolerance).
• Compact SOIC package (4.9mm × 5.99mm × 1.45mm) saves board space.
• Wide operating range (-55°C to +125°C) with derated power up to 125°C.
• Gull-wing terminals (1.27mm pitch) for robust SMT compatibility.
• Non-automotive (PPAP: No) but ideal for industrial and telecom applications.

GS4B024751GDT Applications

This resistor network excels in:

• Voltage dividers and signal conditioning in precision analog circuits.
• Pull-up/pull-down networks for digital logic interfaces.
• Sensor calibration and feedback loops in measurement equipment.
• Power management modules requiring stable, low-drift resistance.
• Embedded systems where space efficiency and reliability are critical.

Conclusion of GS4B024751GDT

The GS4B024751GDT combines precision, compactness, and ruggedness, making it a superior choice for engineers needing reliable resistor networks in industrial, medical, and communication systems. Its ceramic construction, tight tolerances, and bussed design reduce component count and improve signal integrity, while the SOIC package ensures compatibility with automated assembly processes. Though not RoHS-compliant, its performance in harsh environments justifies its use in specialized applications.