TT Electronics/IRC

GS4B024872JFT

GS4B024872JFT Description

The GS4B024872JFT from TT Electronics/IRC is a high-performance 7-resistor bussed network in an 8-pin narrow SOIC (SOIC-C) ceramic package. Designed for precision applications, it features a 48.7KΩ resistance per element with an absolute tolerance of ±5% and a ratio tolerance of ±1%, ensuring consistent performance in matched-resistor circuits. The thin-film technology delivers a low temperature coefficient of ±50ppm/°C, maintaining stability across a wide operating range of -70°C to +125°C. With a power rating of 0.4W (0.05W per resistor) and a maximum voltage rating of 100V, this network is engineered for reliability in demanding environments. Its gull-wing termination and surface-mount design facilitate easy PCB integration.

GS4B024872JFT Features

• Ceramic SOIC Package: Robust construction with 4.9mm length, 5.99mm depth, and 1.45mm height (±0.1mm tolerances).
• Bussed Network: Simplifies circuit design by interconnecting resistors via a common node (BUS).
• High Precision: ±5% absolute and ±1% ratio tolerance for matched performance.
• Stable Performance: ±50ppm/°C TCR ensures minimal drift under thermal stress.
• Wide Temperature Range: Operates from -70°C to +125°C with derated power up to 125°C.
• Surface-Mount Ready: 1.27mm terminal pitch and gull-wing leads for automated assembly.
• Non-Automotive: Suitable for industrial, telecom, and instrumentation applications.

GS4B024872JFT Applications

Ideal for precision voltage dividers, signal conditioning, and impedance matching in:

• Industrial Control Systems: Stable performance in harsh environments.
• Telecommunications Equipment: Low-noise, high-accuracy signal processing.
• Test & Measurement Instruments: Reliable ratio tolerance for calibration circuits.
• Medical Electronics: Consistent operation in critical analog stages.
• Power Management Modules: Efficient dissipation with 0.4W total rating.

Conclusion of GS4B024872JFT

The GS4B024872JFT excels in applications demanding tight tolerance, thermal stability, and compact packaging. Its ceramic SOIC construction and bussed design reduce board space while enhancing reliability. Though non-compliant with EU RoHS, it remains a top choice for industrial and telecom systems where precision and durability are paramount. Engineers will appreciate its balance of performance, size, and cost in high-reliability networks.