TT Electronics/IRC

GS4B0253R6JDT

GS4B0253R6JDT Description

The GS4B0253R6JDT from TT Electronics/IRC is a high-performance 7-resistor bussed network in an 8-pin narrow SOIC package, designed for precision applications requiring stable thin-film technology. With a 53.6Ω resistance per element, this ceramic-based network offers a ±5% absolute tolerance and ±0.5% ratio tolerance, ensuring consistent performance in matched-resistor circuits. Its ±50ppm/°C temperature coefficient and 100V maximum voltage rating make it suitable for environments with moderate thermal and electrical stress. The SOIC-C series construction provides robust mechanical stability, while the gull-wing termination ensures reliable surface-mount assembly.

GS4B0253R6JDT Features

• Ceramic substrate for enhanced thermal stability and durability.
• Thin-film technology delivers low noise and high precision.
• Bussed configuration (BUS) simplifies circuit design by interconnecting resistors.
• 0.05W (1/20) power rating per resistor, with a total power rating of 0.4W.
• Operating temperature range: 70°C to 125°C (derated power).
• Compact dimensions: 4.9mm (L) × 5.99mm (D) × 1.45mm (H) with tight tolerances (±0.1mm L/H, ±0.2mm D).
• 1.27mm terminal pitch for compatibility with standard SOIC layouts.
• Non-automotive (PPAP: No) and non-RoHS compliant, ideal for industrial and legacy systems.

GS4B0253R6JDT Applications

This resistor network excels in:

• Voltage divider circuits requiring tight ratio tolerances (±0.5%).
• Signal conditioning in test/measurement equipment.
• Industrial control systems where ceramic substrates resist harsh environments.
• Legacy electronics needing stable, low-drift resistance networks.
• Space-constrained PCBs due to its compact SOIC footprint.

Conclusion of GS4B0253R6JDT

The GS4B0253R6JDT stands out for its precision, thermal resilience, and compact design, making it a reliable choice for engineers prioritizing stability in moderate-power applications. While not suited for automotive or RoHS-regulated designs, its ceramic construction and thin-film technology offer superior performance in industrial, instrumentation, and legacy systems. Its bussed architecture reduces component count, streamlining circuit layouts without compromising accuracy.