TT Electronics/IRC

GS4B0254R9JGT

GS4B0254R9JGT Description

The GS4B0254R9JGT from TT Electronics/IRC is a high-performance 7-resistor bussed network in an 8-pin narrow SOIC package, designed for precision applications requiring stable thin-film resistance. With a 54.9Ω resistance per element and a ±5% absolute tolerance, this ceramic-based network ensures reliable performance in demanding environments. Its ±50ppm/°C temperature coefficient and 100V maximum voltage rating make it suitable for circuits where thermal stability and voltage handling are critical. The SOIC-C series construction features a rectangular ceramic case with gull-wing termination, optimized for surface-mount assembly in compact PCB layouts.

GS4B0254R9JGT Features

• Bussed Network Design: 7 resistors connected in a common bus configuration, simplifying circuit layout for shared-voltage applications.
• Thin-Film Technology: Delivers low noise and high stability, with a 0.05W (1/20) power rating per resistor and 0.4W total power dissipation.
• Robust Construction: Ceramic substrate enhances thermal conductivity, supporting operation from 70°C to 125°C derated power range.
• Precision Tolerance: ±5% absolute tolerance and ±2% ratio tolerance ensure consistent performance in matched-resistor applications.
• Compact Footprint: 4.9mm length × 5.99mm depth × 1.45mm height with tight tolerances (±0.1mm height/length, ±0.2mm depth) for high-density designs.

GS4B0254R9JGT Applications

Ideal for voltage division, pull-up/pull-down networks, and bus termination in:

• Industrial Control Systems: Stable performance in PLCs and sensor interfaces.
• Telecommunications Equipment: Signal conditioning in high-frequency circuits.
• Automotive Electronics (non-Automotive PPAP): Non-safety-critical modules like infotainment systems.
• Medical Devices: Precision analog circuits where thermal drift must be minimized.

Conclusion of GS4B0254R9JGT

The GS4B0254R9JGT excels in applications demanding compact size, thermal resilience, and electrical consistency. Its ceramic thin-film construction and bussed architecture reduce component count while maintaining accuracy, making it a cost-effective solution for space-constrained designs. While not PPAP-capable or RoHS-compliant, its 125°C operating limit and low TCR justify its use in professional-grade electronics. Engineers should evaluate its non-automotive status but can leverage its reliability for industrial and telecom systems.