TT Electronics/IRC

GS4B025620DAT

GS4B025620DAT Description

The GS4B025620DAT from TT Electronics/IRC is a high-precision 7-resistor thin-film network designed for surface-mount applications. Encased in a ceramic SOIC-8 package, it offers a 562Ω resistance per element with a tight 0.5% tolerance and a low ±50ppm/°C temperature coefficient, ensuring stability across a wide operating range of -70°C to +125°C. Rated for 0.4W total power dissipation (0.05W per resistor) and 100V maximum voltage, this BUS-configured network is ideal for precision analog and digital circuits requiring matched resistance values. Its gull-wing termination and 1.27mm pitch facilitate reliable PCB assembly, while the ceramic substrate enhances thermal performance.

GS4B025620DAT Features

• Precision Thin Film Technology: Delivers low noise and high stability for sensitive applications.
• Compact SOIC-8 Package: Measures 4.9mm (L) × 5.99mm (D) × 1.45mm (H) with tight tolerances (±0.1mm height/length).
• High Power Density: 0.4W total power rating (0.05W per resistor) in a small footprint.
• Wide Temperature Range: Operates reliably from -70°C to +125°C with derated performance.
• Automotive-Grade Alternatives: While this model is not PPAP or automotive-qualified, its ceramic construction suits industrial and telecom applications.
• Non-RoHS Compliant: Suitable for legacy or exempted designs requiring leaded components.

GS4B025620DAT Applications

This resistor network excels in:

• Voltage Divider Networks: Precision attenuation in sensor interfaces.
• Current Limiting: Balanced current distribution in multi-channel ICs.
• Impedance Matching: High-frequency circuits like RF amplifiers or ADCs.
• Industrial Controls: PLC modules requiring stable resistance under thermal stress.
• Legacy Electronics: Military/aerospace systems exempt from RoHS restrictions.

Conclusion of GS4B025620DAT

The GS4B025620DAT combines precision, compactness, and thermal resilience, making it a robust choice for high-reliability analog designs. Its ceramic SOIC package and thin-film technology outperform epoxy-based networks in harsh environments, though designers should note its non-RoHS status. Ideal for industrial, telecom, and legacy systems, this network balances performance with cost-effectiveness in volume production.