TT Electronics/IRC

GS4B025621GFT

GS4B025621GFT Description

The GS4B025621GFT from TT Electronics/IRC is a high-performance 7-resistor bussed network in an 8-pin narrow SOIC (SOIC-C) ceramic package. Designed for precision applications, it features a 5.62KΩ resistance value with a tight ±2% absolute tolerance and ±1% ratio tolerance, ensuring consistent performance in matched circuits. The thin-film technology delivers excellent stability with a low ±50ppm/°C temperature coefficient, making it suitable for environments with fluctuating temperatures. Rated for 0.05W (1/20) per resistor and 0.4W total power dissipation, it operates reliably within a 70°C to 125°C derated power range, with a maximum voltage rating of 100V. The gull-wing termination and surface-mount design facilitate easy PCB integration.

GS4B025621GFT Features

• Ceramic Case & Thin Film Technology: Ensures durability and stable performance under thermal stress.
• Bussed Network (BUS): Simplifies circuit design by connecting multiple resistors in a shared configuration.
• Precision Tolerances: ±2% absolute and ±1% ratio tolerance for high-accuracy applications.
• Wide Temperature Range: Operates from -55°C to 125°C, with derated power up to 125°C.
• Compact SOIC Package: 4.9mm (L) × 5.99mm (D) × 1.45mm (H) with tight dimensional tolerances (±0.1mm height/length, ±0.2mm depth).
• Low TCR (±50ppm/°C): Minimizes resistance drift in varying thermal conditions.

GS4B025621GFT Applications

Ideal for precision analog circuits, voltage dividers, and sensor signal conditioning where matched resistances are critical. Its bussed configuration suits bus termination, pull-up/pull-down networks, and digital logic interfaces. The ceramic construction and thin-film technology make it robust for industrial automation, medical devices, and automotive subsystems (though not PPAP/AEC-Q200 qualified). Also used in test equipment and communication infrastructure due to its low noise and stability.

Conclusion of GS4B025621GFT

The GS4B025621GFT stands out for its precision, compactness, and thermal resilience, offering superior performance in matched-resistance applications. While not automotive-grade, its ceramic SOIC package and thin-film construction provide reliability for industrial and instrumentation designs. Engineers will appreciate its tight tolerances, low TCR, and bussed topology, which reduce component count and simplify layouts in high-density PCBs. A versatile choice for signal integrity-critical systems.