


TT Electronics/IRC
GS4B025760DAT
Why Choose Us?
Professional Platform
B2B & B2C purchasingDelivery at full speed
1-2 days deliveryWide variety
Original manufacturers365 days guarantee
Responsible qualityTech Specifications
GS4B025760DAT Description
GS4B025760DAT Description
The GS4B025760DAT from TT Electronics/IRC is a high-precision 7-resistor thin-film network designed for surface-mount applications. Encased in a ceramic SOIC-8 package, it offers a 576Ω resistance per element with an ultra-tight ±0.5% tolerance and a low ±50ppm/°C temperature coefficient, ensuring stability across a wide operating range (70°C to 125°C). Rated for 0.4W total power dissipation (0.05W per resistor) and 100V maximum voltage, this component is engineered for reliability in demanding circuits. Its gull-wing termination and 1.27mm pitch facilitate easy PCB integration, while the ceramic substrate enhances thermal performance.
GS4B025760DAT Features
- Precision Thin Film Technology: Delivers low noise and high accuracy (±0.5%) for sensitive analog/digital systems.
- Robust Ceramic Package: Superior heat dissipation and mechanical strength vs. plastic alternatives.
- BUS Configuration: Ideal for voltage division, pull-up/pull-down networks, and bus termination.
- Extended Temperature Range: Stable performance up to 125°C, derated for high-power environments.
- Compact & Reliable: 4.9mm × 5.99mm × 1.45mm dimensions with tight tolerances (±0.1mm length/height).
- Non-Automotive (PPAP No): Optimized for industrial, telecom, and instrumentation use.
GS4B025760DAT Applications
- Signal Conditioning: Precision dividers in ADC/DAC circuits.
- Bus Termination: Impedance matching in high-speed data lines (e.g., SPI, I²C).
- Voltage Reference Networks: Stable biasing in op-amp and sensor interfaces.
- Medical/Test Equipment: Where low drift and repeatability are critical.
- Power Management: Feedback networks in DC-DC converters.
Conclusion of GS4B025760DAT
The GS4B025760DAT excels in high-accuracy, thermally challenging applications, leveraging ceramic packaging and thin-film technology for superior performance over plastic-encased networks. Its BUS design, tight tolerances, and extended temperature resilience make it a standout choice for industrial electronics, communication systems, and precision instrumentation. While not RoHS-compliant, its reliability and precision justify its use in specialized sectors demanding uncompromising quality.



.png)














.png?x-oss-process=image/format,webp/resize,h_32)










