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GS4B025761DDT
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GS4B025761DDT Description
GS4B025761DDT Description
The GS4B025761DDT from TT Electronics/IRC is a high-precision 7-resistor thin film network designed for bus applications, housed in an 8-pin SOIC ceramic package. With a 5.76KΩ resistance value and a tight 0.5% tolerance, this component ensures reliable signal integrity in demanding circuits. It operates over a wide temperature range of -70°C to +125°C, with a derated power handling capability up to 125°C, making it suitable for environments with thermal stress. The 0.4W total power rating (0.05W per resistor) and ±50ppm/°C temperature coefficient provide stable performance under varying conditions. Its 100V maximum voltage rating and gull-wing SMD termination facilitate robust surface-mount integration.
GS4B025761DDT Features
- Precision Thin Film Technology: Delivers low noise and high stability for sensitive analog/digital circuits.
- Ceramic SOIC Package: Enhances thermal dissipation and mechanical durability compared to plastic alternatives.
- 7-Resistor BUS Configuration: Optimized for voltage division, pull-up/down networks, and impedance matching.
- Tight Tolerance & Low TCR: 0.5% tolerance and ±50ppm/°C ensure minimal drift in precision applications.
- Automation-Friendly: Gull-wing leads and 1.27mm pitch enable seamless pick-and-place assembly.
- Non-Automotive/Non-PPAP: Ideal for industrial, telecom, and instrumentation where PPAP compliance isn’t required.
GS4B025761DDT Applications
- Signal Conditioning: Precision resistor networks for ADC/DAC reference circuits.
- Bus Termination/Voltage Dividers: Critical in CAN, I2C, and SPI interfaces to mitigate reflections.
- Test & Measurement Equipment: Stable performance in calibration modules and sensor interfaces.
- Power Management: Feedback networks in DC-DC converters or LDO regulators.
- Industrial Controls: PLC modules requiring long-term reliability under thermal cycling.
Conclusion of GS4B025761DDT
The GS4B025761DDT stands out for its ceramic-encased robustness, precision thin film resistors, and BUS-optimized design, offering superior performance in high-reliability industrial and telecom systems. While not PPAP-certified, its thermal resilience and electrical stability make it a cost-effective choice for non-automotive precision applications. Engineers will appreciate its balance of accuracy, power handling, and compact SOIC footprint, streamlining designs where space and performance are critical.



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