TT Electronics/IRC_GS4B0257R6DDT
original

TT Electronics/IRC
GS4B0257R6DDT

50-GS4B0257R6DDT
PDF Datasheet
Res Thin Film NET 57.6 Ohm 0.5% 0.4W ±50ppm/°C BUS Ceramic 8-Pin SOIC Gull Wing SMD Tube
30 weeks

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Tech Specifications

Circuit Designator
BUS
Number of Resistors
7
HTS
8533.21.00.20
Case Style
Ceramic
ECCN (US)
EAR99
Temperature Range @ Derated Power (°C)
70 to 125
PPAP
No
Automotive
No
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GS4B0257R6DDT Description

GS4B0257R6DDT Description

The GS4B0257R6DDT from TT Electronics/IRC is a high-precision 7-resistor thin-film network designed for surface-mount applications. Housed in an 8-pin SOIC ceramic package, it offers a 57.6 Ω resistance per resistor with a tight ±0.5% tolerance and a low ±50 ppm/°C temperature coefficient, ensuring stability across a wide operating range (70°C to 125°C). The BUS circuit designator indicates its suitability for bus termination and signal conditioning. With a 0.4W total power rating (0.05W per resistor) and 100V maximum voltage rating, it balances performance and reliability in compact designs. The gull-wing termination and 1.27mm pitch facilitate easy PCB integration.

GS4B0257R6DDT Features

  • Precision Thin Film Technology: Delivers low noise and high accuracy (±0.5%) for critical analog/digital circuits.
  • Robust Ceramic Package: Enhances thermal stability and durability in harsh environments.
  • Space-Efficient SOIC-8: Compact footprint (4.9mm × 5.99mm × 1.45mm) ideal for high-density PCBs.
  • Wide Temperature Range: Operates reliably from 70°C to 125°C with derated power handling.
  • Low TCR (±50 ppm/°C): Minimizes resistance drift under thermal stress.
  • Automotive-Grade Alternatives: While not PPAP-certified, its performance parallels automotive-grade networks.

GS4B0257R6DDT Applications

  • Bus Termination: Perfect for DDR memory lines, CAN buses, and high-speed digital interfaces requiring impedance matching.
  • Signal Conditioning: Used in ADC/DAC reference dividers, sensor bridges, and precision voltage dividers.
  • Industrial Electronics: Suitable for PLC modules, test equipment, and power supply feedback networks.
  • Aerospace & Defense: Ceramic construction meets demands for thermal shock resistance in avionics.

Conclusion of GS4B0257R6DDT

The GS4B0257R6DDT excels in precision, thermal performance, and space-constrained designs, outperforming generic thick-film networks. Its ceramic SOIC package and thin-film technology make it a top choice for engineers prioritizing stability, accuracy, and miniaturization in industrial, communications, and high-reliability systems. While not RoHS-compliant, its niche performance justifies use in exempted applications.

FAQ

What is the mounting type of GS4B0257R6DDT?
GS4B0257R6DDT uses a Surface Mount mounting style based on the listed product specifications.
What is GS4B0257R6DDT?
Is GS4B0257R6DDT currently in stock?
Are there related or alternative parts for GS4B0257R6DDT?
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