TT Electronics/IRC

GS4B0257R6GT

GS4B0257R6GT Description

The GS4B0257R6GT from TT Electronics/IRC is a high-performance 7-resistor bussed network in an 8-pin narrow SOIC package, designed for precision applications requiring stable resistance values and compact form factors. Built with ceramic substrate and thin-film technology, it offers a 57.6Ω resistance per element with a tight ±2% tolerance and a low ±50ppm/°C temperature coefficient, ensuring reliable performance across a -70°C to +125°C operating range. The SOIC-C series construction provides excellent thermal stability and power dissipation, rated at 0.05W (1/20W) per resistor and 0.4W total power. Its 100V maximum voltage rating and gull-wing termination make it suitable for automated surface-mount assembly.

GS4B0257R6GT Features

• Bussed Network Design: 7 resistors connected in a common bus configuration, simplifying circuit layout.
• High Precision: ±2% absolute tolerance and ±50ppm/°C TCR for stable performance in varying temperatures.
• Robust Construction: Ceramic case with thin-film technology ensures durability and low noise.
• Compact & Reliable: 4.9mm x 5.99mm footprint with a 1.45mm profile, ideal for space-constrained PCBs.
• Automation-Friendly: Gull-wing leads with 1.27mm pitch for seamless SMT assembly.
• Wide Operating Range: Derated power up to 125°C, suitable for industrial environments.

GS4B0257R6GT Applications

This resistor network excels in:

• Voltage Division & Bus Termination: Precision networks in communication systems and data acquisition.
• Signal Conditioning: Analog/digital circuits requiring stable resistance values, such as sensor interfaces.
• Power Management: Current-limiting or pull-up/down applications in embedded systems.
• Automotive & Industrial Electronics: Despite non-automotive PPAP status, its wide temperature range suits harsh environments.

Conclusion of GS4B0257R6GT

The GS4B0257R6GT stands out for its precision, compactness, and thermal resilience, making it a versatile choice for high-density PCB designs demanding reliable resistance networks. Its ceramic thin-film construction and bussed topology offer superior performance over standard thick-film arrays, particularly in temperature-sensitive or noise-critical applications. Engineers will appreciate its balance of size, accuracy, and power handling in industrial, telecom, and embedded systems.