TT Electronics/IRC

GS4B025901FFT

GS4B025901FFT Description

The GS4B025901FFT from TT Electronics/IRC is a high-performance 7-resistor bussed network housed in an 8-pin narrow SOIC (SOIC-C) ceramic package. Designed for precision applications, it features a 5.9KΩ resistance per element with a tight ±1% absolute tolerance and ±1% ratio tolerance, ensuring consistent performance in critical circuits. The thin-film technology delivers a low ±50ppm/°C temperature coefficient, making it stable across a wide operating temperature range of -70°C to +125°C. With a 0.4W total power rating (0.05W per resistor) and 100V maximum voltage rating, this network is engineered for reliability in demanding environments. Its gull-wing termination and surface-mount design facilitate easy PCB integration.

GS4B025901FFT Features

• Ceramic Case: Enhances thermal stability and durability.
• Bussed Configuration: Simplifies circuit design for shared voltage/current paths.
• Precision Thin Film: Delivers ±1% tolerance and ±50ppm/°C TCR for high accuracy.
• Robust Power Handling: 0.4W total dissipation (0.05W per resistor) at derated temperatures up to 125°C.
• Compact SOIC Package: 4.9mm × 5.99mm footprint with ±0.1mm length/height tolerances for space-constrained layouts.
• Non-Automotive Grade: Ideal for industrial, telecom, and instrumentation applications where PPAP compliance is not required.

GS4B025901FFT Applications

This resistor network excels in:

• Voltage Divider Circuits: Precision ratio tolerance ensures consistent signal scaling.
• Bus Termination Networks: Low TCR minimizes drift in high-speed data lines.
• Industrial Control Systems: Ceramic construction withstands harsh operating conditions.
• Test & Measurement Equipment: Thin-film stability guarantees long-term calibration accuracy.
• Power Supply Feedback Loops: Tight tolerances improve regulation performance.

Conclusion of GS4B025901FFT

The GS4B025901FFT combines precision, compactness, and thermal resilience, making it a superior choice for engineers prioritizing stability in bussed resistor applications. Its ceramic SOIC package and thin-film technology outperform generic arrays in environments requiring low drift and high reliability. While not RoHS-compliant, it remains a cost-effective solution for non-automotive sectors demanding exacting performance.