TT Electronics/IRC

GS4B0260R4DT

GS4B0260R4DT Description

The GS4B0260R4DT from TT Electronics/IRC is a high-precision 7-resistor bussed network in an 8-pin narrow SOIC package, designed for demanding surface-mount applications. This ceramic-based thin-film resistor array offers a 60.4Ω resistance per element with an ultra-tight ±0.5% absolute tolerance and a low ±50ppm/°C temperature coefficient, ensuring stable performance across a wide temperature range (70°C to 125°C). The SOIC-C series construction features a gull-wing termination style with a 1.27mm terminal pitch, optimized for automated PCB assembly. With a 0.4W total power rating (0.05W per resistor) and 100V maximum voltage rating, it balances compact dimensions (4.9mm x 5.99mm x 1.45mm) with robust electrical characteristics.

GS4B0260R4DT Features

• Precision Network: 7 bussed resistors with 0.5% tolerance and ±50ppm/°C TCR for minimal drift.
• Robust Construction: Ceramic substrate and thin-film technology enhance thermal stability and longevity.
• Space-Efficient: SOIC package (8-pin) with 1.27mm pitch saves board space versus discrete resistors.
• High Voltage Handling: Supports up to 100V, suitable for industrial and telecom applications.
• Derated Power Handling: Operates at 70–125°C with derated power, ideal for thermally constrained designs.
• Non-Automotive: Compliant with EAR99 ECCN but not PPAP/automotive-qualified.

GS4B0260R4DT Applications

• Signal Conditioning: Precision voltage dividers in test equipment and sensor interfaces.
• Bus Termination: DDR memory or CAN bus networks requiring matched impedance.
• Industrial Controls: PLC I/O modules where space and stability are critical.
• Power Management: Load sharing in low-power DC/DC converters.
• Medical Devices: High-reliability circuits benefiting from ceramic substrate durability.

Conclusion of GS4B0260R4DT

The GS4B0260R4DT excels in high-density, precision applications where tight tolerance, thermal stability, and compact form factor are paramount. Its bussed architecture simplifies PCB layout, while the ceramic SOIC package ensures reliability in harsh environments. Though not RoHS-compliant or automotive-grade, it is a cost-effective solution for industrial, telecom, and medical electronics requiring repeatable performance. Engineers will appreciate its balance of accuracy, power handling, and space savings compared to discrete alternatives.