TT Electronics/IRC

GS4B026490FAT

GS4B026490FAT Description

The GS4B026490FAT from TT Electronics/IRC is a high-precision thin-film resistor network designed for demanding electronic applications. This 7-resistor array features a 649Ω resistance value per element with a tight 1% tolerance and a low ±50ppm/°C temperature coefficient, ensuring stable performance across a wide operating temperature range of -70°C to +125°C. Housed in a ceramic SOIC-8 package with gull-wing SMD termination, it offers excellent thermal stability and reliability in compact designs. The 0.4W total power rating (0.05W per resistor) and 100V maximum voltage rating make it suitable for precision analog and digital circuits.

GS4B026490FAT Features

• Advanced Thin Film Technology: Delivers high accuracy and low noise for sensitive signal conditioning.
• Robust Ceramic Case: Enhances thermal dissipation and mechanical durability in harsh environments.
• Space-Efficient SOIC-8 Package: Ideal for high-density PCB layouts with 4.9mm × 5.99mm × 1.45mm dimensions.
• Automated Assembly Compatibility: Gull-wing leads and 1.27mm pitch simplify pick-and-place processes.
• Non-Automotive (PPAP No): Optimized for industrial, telecom, and instrumentation use.
• Non-RoHS Compliant: Suitable for legacy or specialized applications requiring alternative material compliance.

GS4B026490FAT Applications

This resistor network excels in:

• Voltage Division & Pull-Up/Down Circuits: Precision-matched resistors ensure consistent performance in ADC/DAC interfaces.
• Signal Termination Networks: Low TCR minimizes drift in high-speed data lines (e.g., LVDS, USB).
• Industrial Control Systems: Ceramic construction withstands thermal cycling in PLCs and motor drives.
• Test & Measurement Equipment: Stable resistance under load critical for calibration and sensor conditioning.

Conclusion of GS4B026490FAT

The GS4B026490FAT combines precision, compactness, and reliability, making it a standout choice for engineers needing stable resistor networks in constrained spaces. Its thin-film technology and ceramic packaging address challenges like thermal drift and mechanical stress, while the SOIC-8 format ensures compatibility with modern SMD workflows. While not suited for automotive use, it is a robust solution for industrial, communication, and precision electronics where consistent performance is paramount.