TT Electronics/IRC

GS4B026651JFT

GS4B026651JFT Description

The GS4B026651JFT from TT Electronics/IRC is a high-performance 7-resistor bussed network in an 8-pin narrow SOIC package, designed for precision applications requiring stable thin-film resistance. With a 6.65KΩ resistance value and ±5% absolute tolerance, this ceramic-based network ensures reliable performance in demanding environments. Its ±50ppm/°C temperature coefficient and 0.05W (1/20) power rating per resistor make it suitable for circuits where thermal stability and low power dissipation are critical. The SOIC-C series construction offers robust mechanical integrity, while the gull-wing termination facilitates easy surface-mount assembly. Rated for 100V maximum voltage and operating within -70°C to +125°C, it meets the needs of industrial and consumer electronics.

GS4B026651JFT Features

• Bussed Network Design: Simplifies PCB layout with a shared common terminal (BUS) for streamlined circuit integration.
• Thin-Film Technology: Delivers high precision (±1% ratio tolerance) and low noise for signal conditioning.
• Wide Temperature Range: Stable performance from -70°C to +125°C, even at derated power.
• Compact & Robust: 4.9mm × 5.99mm × 1.45mm ceramic SOIC package with ±0.1mm length/height tolerances.
• Automotive-Grade Alternatives: While not PPAP-certified, its 125°C max operating temp suits harsh environments.
• Non-RoHS Compliant: Ideal for legacy or specialized applications exempt from RoHS restrictions.

GS4B026651JFT Applications

• Voltage Divider Networks: Precision ratio tolerance (±1%) ensures accurate signal scaling.
• Industrial Control Systems: Thin-film stability resists thermal drift in PLCs and sensors.
• Consumer Electronics: Compact SOIC footprint fits space-constrained designs like set-top boxes.
• Test & Measurement Equipment: Low TCR (±50ppm/°C) maintains calibration integrity.
• Power Supply Feedback Circuits: Bussed design simplifies feedback loop routing.

Conclusion of GS4B026651JFT

The GS4B026651JFT excels in applications demanding tight tolerance, thermal resilience, and space efficiency. Its ceramic construction and thin-film technology provide superior reliability over thick-film alternatives, while the bussed topology reduces component count. Though not RoHS-compliant, it remains a cost-effective solution for non-regulated or high-temperature environments. Engineers will value its balance of precision, power handling, and compact form factor in analog and mixed-signal designs.