TT Electronics/IRC

GS4B026651JT

GS4B026651JT Description

The GS4B026651JT from TT Electronics/IRC is a high-reliability ceramic resistor network designed for precision applications. Housed in an 8-pin narrow SOIC package, this bussed network integrates 7 resistors with a common 6.65KΩ value, offering a ±5% tolerance and a low ±50ppm/°C temperature coefficient. Its thin-film technology ensures stable performance across a wide temperature range (70°C to 125°C), with a derated power rating of 0.05W per resistor (0.4W total). The SOIC-C series construction features a rectangular ceramic case, gull-wing terminations, and a compact footprint (4.9mm x 5.99mm x 1.45mm), making it ideal for space-constrained designs. Rated for 100V maximum voltage, it is suited for surface-mount applications requiring robust thermal and electrical performance.

GS4B026651JT Features

• Ceramic substrate for enhanced thermal stability and durability.
• Bussed (BUS) configuration simplifies circuit design by connecting multiple resistors to a common node.
• Low TCR (±50ppm/°C) ensures minimal resistance drift under temperature fluctuations.
• Narrow SOIC (SOIC-C) package optimizes PCB space while maintaining high power dissipation (0.4W total).
• Thin-film technology delivers superior accuracy and long-term reliability compared to thick-film alternatives.
• Gull-wing terminations facilitate automated assembly and strong solder joints.
• Non-automotive (PPAP: No) but suitable for industrial, telecom, and instrumentation applications.

GS4B026651JT Applications

This resistor network excels in:

• Voltage division and signal conditioning in precision analog circuits.
• Pull-up/pull-down networks for digital logic interfaces.
• Industrial control systems requiring stable performance in harsh environments.
• Telecommunication equipment where space efficiency and thermal management are critical.
• Test and measurement devices demanding tight tolerance (±5%) and low TCR.

Conclusion of GS4B026651JT

The GS4B026651JT stands out for its ceramic construction, bussed topology, and thin-film precision, making it a superior choice for applications prioritizing stability, compactness, and ease of integration. While not RoHS-compliant, its wide operating temperature range and low TCR make it ideal for industrial and telecom designs. Engineers will appreciate its balance of performance and reliability in demanding circuits.