TT Electronics/IRC

GS4B026982GDT

GS4B026982GDT Description

The GS4B026982GDT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications. Housed in an 8-pin narrow SOIC package, this bussed (BUS) network integrates 7 thin-film resistors, each with a 69.8KΩ resistance and a tight ±2% absolute tolerance. The device operates over a wide temperature range of 70°C to 125°C with a derated power rating, ensuring reliability in demanding environments. Its ±50ppm/°C temperature coefficient and ±0.5% ratio tolerance make it ideal for circuits requiring stable resistance matching. The SOIC-C series construction features a rectangular ceramic case, gull-wing termination, and surface-mount compatibility, offering robust mechanical and electrical performance.

GS4B026982GDT Features

• Precision Thin-Film Technology: Delivers low TCR (±50ppm/°C) and high accuracy (±2%) for stable performance.
• Bussed Network Design: Simplifies PCB layout with shared connections, reducing component count.
• Robust Ceramic Package: SOIC-C series ensures durability and efficient heat dissipation.
• High Power Handling: 0.4W total power rating (0.05W per resistor) supports moderate loads.
• Wide Voltage Range: 100V maximum rating accommodates diverse circuit requirements.
• Automated Assembly Friendly: Gull-wing leads and 1.27mm pitch enable seamless SMT integration.
• Non-Automotive Grade: Suitable for industrial, telecom, and instrumentation applications.

GS4B026982GDT Applications

• Voltage Dividers & Signal Conditioning: Precision resistance matching for sensor interfaces.
• Industrial Control Systems: Reliable performance in PLCs and motor drives.
• Medical Electronics: Stable operation in diagnostic equipment due to low drift.
• Telecom Infrastructure: Impedance matching in RF and baseband circuits.
• Test & Measurement: High-accuracy networks for calibration and reference circuits.

Conclusion of GS4B026982GDT

The GS4B026982GDT excels in applications demanding precision, stability, and compactness. Its ceramic construction, thin-film resistors, and bussed topology provide superior performance over standard arrays, while the SOIC package ensures compatibility with modern SMT processes. Though not PPAP or automotive-qualified, it is a cost-effective solution for industrial, medical, and telecom systems requiring tight tolerance and thermal stability. Engineers will appreciate its balance of accuracy, power handling, and space efficiency in high-reliability designs.