TT Electronics/IRC

GS4B027320JFT

GS4B027320JFT Description

The GS4B027320JFT from TT Electronics/IRC is a high-performance 7-resistor bussed network in an 8-pin narrow SOIC package, designed for precision applications requiring stable resistance values and compact form factors. Built with ceramic substrate and thin-film technology, it delivers excellent thermal stability with a ±50ppm/°C temperature coefficient and a 5% tolerance on its 732Ω resistance value. Rated for 100V maximum voltage and 0.4W total power dissipation, it operates reliably across a -70°C to +125°C temperature range. The gull-wing termination and surface-mount design ensure compatibility with automated assembly processes, while its 1.45mm low profile suits space-constrained PCB layouts.

GS4B027320JFT Features

• Bussed Network Topology: Simplifies circuit design by interconnecting resistors, reducing component count.
• High Stability: Thin-film construction and ceramic case ensure minimal drift under thermal stress (±50ppm/°C).
• Robust Power Handling: 0.05W per resistor (0.4W total) with derating up to 125°C.
• Precision Tolerance: ±5% absolute tolerance and ±1% ratio tolerance for matched performance.
• Compact & Reliable: SOIC package (4.9mm × 5.99mm × 1.45mm) with ±0.1mm dimensional tolerances for consistent placement.
• Automation-Friendly: Gull-wing leads with 1.27mm pitch for seamless SMT integration.

GS4B027320JFT Applications

Ideal for signal conditioning, voltage division, and bus termination in:

• Industrial Control Systems: Stable resistance in harsh environments (e.g., PLCs, motor drives).
• Telecommunications: Impedance matching and filtering in RF/analog circuits.
• Medical Electronics: Precision networks for diagnostic equipment where drift is critical.
• Automotive (Non-Automotive Grade): Auxiliary circuits in infotainment or lighting systems (note: not PPAP-compliant).

Conclusion of GS4B027320JFT

The GS4B027320JFT excels in applications demanding compact size, thermal resilience, and consistent performance. Its bussed design reduces PCB complexity, while thin-film technology ensures long-term reliability. Though not RoHS-compliant, it remains a cost-effective choice for industrial and telecom systems where precision and durability outweigh regulatory constraints. Engineers will appreciate its balance of power handling, tolerance accuracy, and ease of integration in high-density designs.