


TT Electronics/IRC
GS4B027321JGT
Why Choose Us?
Professional Platform
B2B & B2C purchasingDelivery at full speed
1-2 days deliveryWide variety
Original manufacturers365 days guarantee
Responsible qualityTech Specifications
GS4B027321JGT Description
GS4B027321JGT Description
The GS4B027321JGT from TT Electronics/IRC is a high-performance 7-resistor bussed network in an 8-pin narrow SOIC (SOIC-C) ceramic package, designed for precision applications requiring stable thin-film resistance. With a 7.32KΩ resistance per element and a ±5% absolute tolerance (±2% ratio tolerance), this network ensures reliable signal conditioning and voltage division. Its ±50ppm/°C temperature coefficient and 125°C maximum operating temperature make it suitable for environments with moderate thermal stress. The 0.05W (1/20W) power rating per resistor and 100V maximum voltage rating balance compactness with robustness. Packaged in a tube, it features gull-wing terminations for secure surface-mount assembly.
GS4B027321JGT Features
- Ceramic SOIC-C Case: Enhances thermal stability and mechanical durability.
- Bussed Network (7 Resistors): Simplifies circuit design for common-node applications.
- Thin-Film Technology: Delivers low noise and high accuracy (±5% tolerance).
- Wide Temperature Range: Operates from 70°C to 125°C with derated power.
- Compact Dimensions: 4.9mm (L) × 5.99mm (D) × 1.45mm (H) with tight tolerances (±0.1mm height/length).
- 1.27mm Terminal Pitch: Compatible with standard SOIC PCB layouts.
- Non-Automotive (PPAP No): Ideal for industrial and consumer electronics.
GS4B027321JGT Applications
This resistor network excels in:
- Voltage Dividers: Precision reference circuits in test equipment.
- Signal Conditioning: Buffering/attenuation in sensor interfaces.
- Consumer Electronics: Dense PCBs requiring stable passive networks.
- Industrial Controls: PLCs and power management systems.
- Non-RoHS Applications: Legacy or exempted designs where compliance isn’t critical.
Conclusion of GS4B027321JGT
The GS4B027321JGT stands out for its ceramic construction, tight tolerance, and bussed topology, offering reliability in space-constrained designs. While not suited for automotive or high-power applications, its low TCR and robust packaging make it a cost-effective choice for industrial and consumer electronics. Engineers benefit from its ease of integration and consistent performance across thermal cycles.



.png)















.png?x-oss-process=image/format,webp/resize,h_32)










