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GS4B027681FBT
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GS4B027681FBT Description
GS4B027681FBT Description
The GS4B027681FBT from TT Electronics/IRC is a high-precision 7-resistor bussed network housed in an 8-pin narrow SOIC (SOIC-C) ceramic package. Designed for surface-mount applications, it features a 7.68KΩ resistance value with a tight ±1% absolute tolerance and ±0.1% ratio tolerance, ensuring exceptional accuracy in signal conditioning and voltage division circuits. Its thin-film technology delivers stable performance with a low ±50ppm/°C temperature coefficient, making it suitable for environments with operating temperatures ranging from 70°C to 125°C. The 0.05W (1/20W) power rating per resistor and 100V maximum voltage rating further enhance its reliability in precision analog and digital systems.
GS4B027681FBT Features
- Ceramic Case & SOIC Package: Ensures robust thermal and mechanical stability.
- Bussed Network Design: Simplifies PCB layout with shared common terminals.
- High Precision: ±1% absolute tolerance and ±0.1% ratio tolerance for critical applications.
- Low TCR: ±50ppm/°C minimizes resistance drift over temperature.
- Compact Dimensions: 4.9mm (L) × 5.99mm (D) × 1.45mm (H) with tight tolerances (±0.1mm height, ±0.2mm depth).
- Gull Wing Termination: Facilitates reliable soldering in automated SMT processes.
- Non-Automotive Grade: Ideal for industrial, telecom, and instrumentation use.
GS4B027681FBT Applications
This resistor network excels in:
- Voltage Dividers: Precision reference circuits in ADCs/DACs.
- Signal Conditioning: Buffering and scaling in sensor interfaces.
- Industrial Controls: Feedback networks for op-amps and comparators.
- Telecom Equipment: Impedance matching and termination in high-frequency PCBs.
- Test & Measurement: Calibration circuits requiring stable, low-drift resistance.
Conclusion of GS4B027681FBT
The GS4B027681FBT stands out for its ceramic construction, tight tolerances, and bussed architecture, offering superior performance in precision electronics. While not PPAP or RoHS compliant, its thin-film technology and SOIC packaging make it a preferred choice for engineers prioritizing accuracy, thermal stability, and space efficiency. Ideal for industrial and telecom systems, it bridges the gap between cost-effectiveness and high-end performance in resistor networks.



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