TT Electronics/IRC

GS4B0276R8GDT

GS4B0276R8GDT Description

The GS4B0276R8GDT from TT Electronics/IRC is a high-performance 7-resistor bussed network in an 8-pin narrow SOIC package. Designed for precision applications, it features a 76.8Ω resistance value with a tight ±2% absolute tolerance and ±0.5% ratio tolerance, ensuring consistent performance in critical circuits. The network employs thin-film technology on a ceramic substrate, delivering excellent stability and low noise. With a ±50ppm/°C temperature coefficient, it maintains reliable operation across a -70°C to +125°C temperature range. The SOIC-C series construction offers robust mechanical durability, while the gull-wing termination ensures secure surface mounting. Rated for 100V maximum voltage and 0.4W total power dissipation, it is ideal for space-constrained designs requiring high accuracy and thermal resilience.

GS4B0276R8GDT Features

• Bussed Network Design: 7 resistors connected in a bus configuration, simplifying PCB layout.
• Precision Thin Film: Delivers ±2% tolerance and ±50ppm/°C TCR for stable performance.
• High Power Handling: 0.05W per resistor (0.4W total) with derating up to 125°C.
• Robust Packaging: Ceramic-based SOIC case with 1.27mm terminal pitch for dense PCB integration.
• Wide Voltage Range: Supports up to 100V, suitable for industrial and automotive environments (non-AEC-Q qualified).
• Compact Dimensions: 4.9mm (L) × 5.99mm (D) × 1.45mm (H) with tight tolerances (±0.1mm).

GS4B0276R8GDT Applications

• Voltage Divider Networks: Precision signal conditioning in sensor interfaces.
• Bus Termination: Impedance matching in high-speed digital circuits (e.g., SPI, I²C).
• Industrial Controls: Stable resistance in PLCs, motor drives, and power supplies.
• Test & Measurement Equipment: Low-drift performance for calibration circuits.
• Consumer Electronics: Space-efficient solutions for audio/video processing.

Conclusion of GS4B0276R8GDT

The GS4B0276R8GDT excels in applications demanding high precision, thermal stability, and compact form factors. Its ceramic substrate and thin-film technology provide superior reliability over carbon-based networks, while the bussed design reduces component count. Though not PPAP or automotive-qualified, it is a cost-effective choice for industrial and consumer electronics where tight tolerances and low TCR are critical. Engineers will appreciate its balance of performance, durability, and ease of integration in high-density PCBs.