
TT Electronics/IRC
GS4B027872GGT
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GS4B027872GGT Description
GS4B027872GGT Description
The GS4B027872GGT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications in demanding electronic circuits. This 8-pin narrow SOIC package features 7 bussed resistors with a 78.7KΩ resistance value and a tight ±2% absolute tolerance, ensuring consistent performance across a wide temperature range of 70°C to 125°C. Built with thin-film technology, it offers excellent stability with a low temperature coefficient of ±50ppm/°C. The device is housed in a rectangular ceramic SOIC case, providing robust thermal and mechanical durability. With a power rating of 0.4W (0.05W per resistor) and a maximum voltage rating of 100V, it is ideal for space-constrained, high-reliability designs.
GS4B027872GGT Features
- Ceramic Construction: Enhances thermal performance and durability in harsh environments.
- Bussed Network Design: Simplifies circuit layout with 7 interconnected resistors.
- Precision Tolerance: ±2% absolute and ratio tolerance for accurate signal conditioning.
- Low TCR: ±50ppm/°C ensures minimal resistance drift over temperature.
- Surface-Mount Gull Wing Terminals: Facilitates easy PCB assembly with a 1.27mm pitch.
- Compact Dimensions: 4.9mm (L) × 5.99mm (D) × 1.45mm (H) with tight tolerances (±0.1mm height/length, ±0.2mm depth).
- Wide Operating Range: Rated for 125°C maximum temperature, derated up to 125°C.
GS4B027872GGT Applications
This resistor network excels in:
- Analog Signal Processing: Voltage dividers, feedback networks, and precision DAC/ADC circuits.
- Industrial Electronics: PLCs, sensor interfaces, and control systems requiring stable resistance.
- Automotive & Aerospace (non-automotive grade): Auxiliary systems where ceramic robustness is critical.
- Medical Devices: Low-noise, high-reliability instrumentation.
- Telecom Infrastructure: Signal conditioning in base stations and RF modules.
Conclusion of GS4B027872GGT
The GS4B027872GGT stands out for its ceramic-based reliability, precision tolerances, and compact SOIC footprint, making it a superior choice for engineers prioritizing stability in thermally challenging environments. While not PPAP or automotive-qualified, its thin-film technology and bussed architecture deliver consistent performance in industrial, medical, and telecom applications where resistance accuracy and thermal resilience are paramount.



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