TT Electronics/IRC

GS4B028251GGT

GS4B028251GGT Description

The GS4B028251GGT from TT Electronics/IRC is a high-performance 7-resistor bussed network in an 8-pin narrow SOIC (SOIC-C) ceramic package, designed for precision applications requiring stable thin-film resistance. With a 8.25KΩ resistance value and ±2% absolute tolerance, this network ensures consistent performance across its ±50ppm/°C temperature coefficient range. Rated for 0.05W (1/20W) per resistor and 0.4W total power dissipation, it operates reliably from 70°C to 125°C derated, with a maximum voltage rating of 100V. The gull-wing termination and surface-mount design facilitate automated assembly, while the ceramic case enhances thermal stability and durability.

GS4B028251GGT Features

• Bussed Network Architecture: Simplifies circuit design by interconnecting resistors, reducing component count.
• Thin-Film Technology: Delivers superior accuracy (±2% tolerance) and low TCR (±50ppm/°C) for precision applications.
• Robust Construction: Ceramic substrate ensures high thermal conductivity and mechanical strength.
• Compact SOIC Package: 4.9mm × 5.99mm × 1.45mm dimensions with tight tolerances (±0.1mm height/length, ±0.2mm depth) save PCB space.
• Wide Operating Range: Suitable for harsh environments (-55°C to +125°C non-derated).
• Automation-Friendly: Gull-wing leads and 1.27mm pitch enable high-speed pick-and-place assembly.

GS4B028251GGT Applications

Ideal for:

• Voltage Divider Networks: Precision signal conditioning in sensor interfaces.
• Bus Termination: Impedance matching in high-speed digital circuits (e.g., memory modules).
• Industrial Controls: Stable resistance in PLCs, motor drives, and power supplies.
• Medical Electronics: Reliable performance in diagnostic equipment where consistency is critical.
• Automotive Systems (non-AECQ): Non-safety-critical modules like infotainment, though not PPAP or automotive-qualified.

Conclusion of GS4B028251GGT

The GS4B028251GGT excels in precision, thermal stability, and space efficiency, making it a top choice for high-density PCBs requiring reliable resistor networks. Its ceramic construction and thin-film technology outperform standard thick-film arrays in accuracy and temperature resilience. While not RoHS-compliant, it remains a robust solution for industrial, medical, and telecom applications demanding tight tolerances and long-term reliability. For designs needing bussed resistors with low TCR, this model offers an optimal balance of performance and manufacturability.