TT Electronics/IRC

GS4B0282R0DT

GS4B0282R0DT Description

The GS4B0282R0DT from TT Electronics/IRC is a high-precision 7-resistor bussed network housed in an 8-pin narrow SOIC package. Designed with thin-film technology on a ceramic substrate, it delivers exceptional stability with a ±50ppm/°C temperature coefficient and a tight ±0.5% absolute tolerance. The network features a 82Ω resistance per element, rated for 0.05W (1/20W) per resistor and 0.4W total power dissipation. Its SOIC-C series construction ensures reliable performance in surface-mount applications, with a 100V maximum voltage rating and operation up to 125°C. The gull-wing termination and 1.27mm terminal pitch facilitate easy PCB integration.

GS4B0282R0DT Features

• Ceramic Case & Thin Film: Ensures low noise, high stability, and durability in harsh environments.
• Precision Tolerance: ±0.5% absolute tolerance and ±50ppm/°C TCR for critical analog/digital circuits.
• Bussed Design: Simplifies circuit layout with shared common terminals (BUS configuration).
• High-Temp Operation: Derated power capability from 70°C to 125°C, ideal for industrial/automotive underhood applications (though non-PPAP).
• Compact SOIC Package: 4.9mm (L) × 5.99mm (D) × 1.45mm (H) with ±0.1mm dimensional tolerances for space-constrained designs.
• Non-RoHS: Suitable for legacy or specialized systems where lead-free compliance isn’t required.

GS4B0282R0DT Applications

• Voltage Divider Networks: Precision dividers in sensor interfaces or ADC reference circuits.
• Bus Termination: Impedance matching in CAN, LIN, or I2C communication lines.
• Industrial Controls: PLCs, motor drives, and power supplies requiring stable resistance under thermal stress.
• Test & Measurement Equipment: Calibration circuits or signal conditioning where low drift is critical.
• Legacy Electronics: Military/aerospace systems needing non-RoHS compliant components.

Conclusion of GS4B0282R0DT

The GS4B0282R0DT excels in precision, thermal resilience, and space efficiency, making it a robust choice for high-reliability electronics. Its ceramic thin-film construction and bussed architecture reduce design complexity while maintaining performance in wide-temperature or high-voltage scenarios. Though unsuitable for PPAP or automotive-qualified projects, it remains a cost-effective solution for industrial, communication, and legacy systems demanding tight-tolerance resistor networks.