TT Electronics/IRC

GS4B028871FAT

GS4B028871FAT Description

The GS4B028871FAT from TT Electronics/IRC is a high-precision 7-resistor thin film network designed for surface-mount applications in demanding electronic circuits. Encased in a ceramic SOIC-8 package, it offers an 8.87KΩ resistance per resistor with a tight 1% tolerance and a low ±50ppm/°C temperature coefficient, ensuring stable performance across a wide temperature range (70°C to 125°C). Rated for 0.4W total power dissipation (0.05W per resistor) and 100V maximum voltage, this component is engineered for reliability in precision analog and digital systems. Its gull-wing termination and 1.27mm terminal pitch facilitate easy PCB integration, while the ceramic substrate enhances thermal stability and durability.

GS4B028871FAT Features

• High Precision: 1% tolerance and ±50ppm/°C TCR for consistent performance.
• Robust Construction: Ceramic case ensures thermal and mechanical resilience.
• Space-Efficient: Compact 4.9mm × 5.99mm × 1.45mm footprint ideal for dense layouts.
• Wide Operating Range: Derated power up to 125°C, suitable for industrial environments.
• BUS Configuration: Simplifies circuit design in multi-resistor applications.
• Thin Film Technology: Delivers low noise and high stability vs. thick-film alternatives.

GS4B028871FAT Applications

• Analog Signal Conditioning: Precision voltage dividers, feedback networks.
• Industrial Controls: PLCs, sensor interfaces requiring stable resistance.
• Automotive Electronics (non-AECQ): Non-safety-critical systems like infotainment.
• Test & Measurement Equipment: Calibration circuits, reference networks.
• Medical Devices: Diagnostic instruments where accuracy is critical.

Conclusion of GS4B028871FAT

The GS4B028871FAT excels in precision and reliability, leveraging thin-film technology and ceramic packaging for superior performance in harsh conditions. While not PPAP or automotive-qualified, its low TCR, tight tolerance, and BUS configuration make it a standout choice for industrial, medical, and instrumentation designs. Engineers will appreciate its balance of miniaturization, power handling, and thermal stability, particularly in space-constrained, high-accuracy applications.