TT Electronics/IRC

GS4B0288R7GDT

GS4B0288R7GDT Description

The GS4B0288R7GDT from TT Electronics/IRC is a high-performance 7-resistor bussed network in an 8-pin narrow SOIC package, designed for precision applications requiring stable thin-film resistance. With a 88.7Ω resistance value and a tight ±2% absolute tolerance, this ceramic-based network ensures reliable performance in demanding environments. Its ±50ppm/°C temperature coefficient and 100V maximum voltage rating make it suitable for circuits exposed to thermal or electrical stress. The SOIC-C series construction features gull-wing termination for secure surface mounting, while the 0.05W (1/20) power rating per resistor and 0.4W total power handling balance compactness with robustness.

GS4B0288R7GDT Features

• Advanced Thin Film Technology: Delivers superior stability and low noise compared to thick-film alternatives.
• Bussed Circuit Design: Simplifies PCB layout by connecting resistors in a shared configuration (BUS designation).
• High-Temperature Operation: Rated for -70°C to +125°C, ensuring reliability in industrial or automotive-adjacent systems (though not PPAP/automotive-certified).
• Precision Tolerances: ±2% absolute and ±0.5% ratio tolerance for matched resistance values.
• Compact & Robust: 4.9mm × 5.99mm × 1.45mm dimensions with ±0.1mm length/height tolerances for space-constrained designs.
• Non-RoHS Compliant: Ideal for legacy or specialized applications requiring non-compliant materials.

GS4B0288R7GDT Applications

• Voltage Division Circuits: Precision dividers in sensor interfaces or ADC reference networks.
• Bus Termination: Signal integrity solutions for low-power digital buses (e.g., SPI, I²C).
• Industrial Control Systems: Stable resistance in PLCs, motor drives, or power supplies.
• Test & Measurement Equipment: Calibration networks requiring tight tolerance and low TCR.
• Legacy Electronics: Maintenance or repair of older systems where RoHS compliance is not mandated.

Conclusion of GS4B0288R7GDT

The GS4B0288R7GDT excels in applications demanding compact size, precision, and thermal resilience. Its ceramic substrate and thin-film technology provide long-term stability, while the bussed configuration reduces component count. Though not automotive-grade, it is a cost-effective choice for industrial, instrumentation, and legacy systems. Engineers will appreciate its balance of performance, tolerance, and power handling in space-sensitive designs.