TT Electronics/IRC

GS4B029311FT

GS4B029311FT Description

The GS4B029311FT from TT Electronics/IRC is a high-performance 7-resistor bussed network in an 8-pin narrow SOIC package, designed for precision applications. Featuring a 9.31KΩ resistance value with a tight ±1% tolerance, this thin-film ceramic-based network ensures stable performance across a wide temperature range (70°C to 125°C). Its ±50ppm/°C temperature coefficient minimizes resistance drift, making it ideal for environments requiring thermal stability. The SOIC-C series construction offers 0.4W total power dissipation (0.05W per resistor), with a 100V maximum voltage rating, and is housed in a compact 4.9mm × 5.99mm × 1.45mm footprint.

GS4B029311FT Features

• Ceramic substrate for enhanced thermal and mechanical reliability.
• Gull-wing termination ensures robust surface-mount (SMD) compatibility.
• Bussed (BUS) circuit design simplifies PCB layout for common-node applications.
• 1.27mm terminal pitch accommodates high-density designs.
• Non-automotive (PPAP: No) but suitable for industrial and telecom applications.
• Thin-film technology delivers superior accuracy and low noise.
• Non-RoHS compliant, catering to legacy or specialized requirements.

GS4B029311FT Applications

This resistor network excels in:

• Voltage divider circuits in test/measurement equipment.
• Signal conditioning for sensors and data acquisition systems.
• Industrial control systems requiring stable, derated power handling.
• Telecommunication infrastructure where precision and thermal performance are critical.
• Legacy electronics needing non-RoHS compliant components.

Conclusion of GS4B029311FT

The GS4B029311FT stands out for its precision, compact SOIC packaging, and bussed topology, offering designers a reliable solution for space-constrained, high-accuracy applications. Its ceramic construction and thin-film technology ensure durability and performance in demanding environments, while its non-RoHS status provides flexibility for niche markets. Ideal for engineers prioritizing thermal stability, tight tolerances, and simplified PCB routing.