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GS4B031072CT
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GS4B031072CT Description
GS4B031072CT Description
The GS4B031072CT from TT Electronics/IRC is a high-precision 7-resistor bussed network in an 8-pin narrow SOIC (SOIC-C) ceramic package. Designed for demanding applications, it features a 10.7KΩ resistance per element with an ultra-tight ±0.25% absolute tolerance and a low ±25ppm/°C temperature coefficient, ensuring stability across a wide operating temperature range of 70°C to 125°C. The thin-film technology delivers superior accuracy and reliability, while the 0.05W (1/20) power rating per resistor and 0.4W total power rating make it suitable for low-power circuits. Its 100V maximum voltage rating and gull-wing termination enable robust performance in surface-mount designs.
GS4B031072CT Features
- Ceramic SOIC-C Case: Enhances thermal performance and durability in harsh environments.
- Bussed Network (BUS): Simplifies circuit design with shared connections, reducing component count.
- Precision Thin Film: Offers ±0.25% tolerance and ±25ppm/°C TCR for critical analog/digital systems.
- Compact Dimensions: 4.9mm (L) x 5.99mm (D) x 1.45mm (H) with tight tolerances (±0.1mm L/H, ±0.2mm D).
- Wide Temperature Range: Derated power operation up to 125°C, ideal for industrial/automotive (non-PPAP).
- Surface-Mount Gull Wing: Ensures reliable soldering and compatibility with automated assembly.
GS4B031072CT Applications
This resistor network excels in:
- Precision Voltage Dividers: High-accuracy signal conditioning in instrumentation.
- ADC/DAC Reference Circuits: Stable resistance for analog-to-digital/digital-to-analog converters.
- Industrial Control Systems: Reliable performance in PLCs and sensor interfaces.
- Medical Electronics: Low-noise, stable resistance for diagnostic equipment.
- Telecom Infrastructure: Signal processing and filtering in base stations.
Conclusion of GS4B031072CT
The GS4B031072CT combines precision, compactness, and ruggedness, making it a standout choice for engineers needing reliable resistor networks in space-constrained, high-performance designs. Its ceramic construction, bussed architecture, and thin-film technology provide a competitive edge over polymer-based or less stable alternatives. While not automotive-grade (non-PPAP), it is ideal for industrial, medical, and telecom applications where accuracy and thermal resilience are critical.



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